New SMT Equipment: qfp bent leads (Page 1 of 4)

BGA Rework Services

BGA Rework Services

New Equipment | Rework & Repair Services

BGA Rework Services Offered  BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum

Precision PCB Services, Inc

Lead Free SMT Training Kit

Lead Free SMT Training Kit

New Equipment | Education/Training

BEST SMT training kits feature REAL circuit boards that represent actual soldering conditions. These training kits feature 0.062in  thick multilayer boards which are more representative of the thermal conditions of "real" circuit boards. This SMT tra

BEST Inc.

FX Series AOI

FX Series AOI

New Equipment | Inspection

500,000 components per hour Maximum Board Size: 22” x 20” (560mm x 510mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option

Nordson YESTECH

BX AOI - Benchtop Automated Optical Inspection

BX AOI - Benchtop Automated Optical Inspection

New Equipment | Inspection

500,000 components per hour Maximum Board Size: 18” x 20” (457mm x 508mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option

Nordson YESTECH

FX-940 AOI - Automated In-line PCB Inspection

FX-940 AOI - Automated In-line PCB Inspection

New Equipment | Inspection

1.5 million components per hour Maximum Board Size: 20” x 21” (500mm x 525mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option

Nordson YESTECH

Counterfeit Component Detection

New Equipment | Inspection

Methods in accordance with PRO-STD-001, SAE AS 5553, and SAE AS 6081.  Process follows ISO/DIS 12931. Datest tools and training are used to detect packaging damage; ESD compliance violations; falsified or altered documentation; tampered part markin

Datest

Lead Free Hot Air Reflow Oven

Lead Free Hot Air Reflow Oven

New Equipment |  

-Individual module heat zone design is convenience for maintenance -Adopts ��Star Shape Heater�� that is high solder performance for BGA, QFP components

Trust Supplies

M1m AOI - Automated Optical Inspection for Microelectronics

M1m AOI - Automated Optical Inspection for Microelectronics

New Equipment | Inspection

3550 sq. mm second (> 5.5 sq. in / second) Maximum Board Size: 350mm x 250mm (14 x 10 in.) Minimum Board Size: 50mm x 50mm (2 x 2 in.) Topside Clearance: 25mm (1 in.) Bot

Nordson YESTECH

M1 Series AOI - In-Line Automated Inspection

M1 Series AOI - In-Line Automated Inspection

New Equipment | Inspection

3550 sq. mm second (> 5.5 sq. in / second) Maximum Board Size: 350mm x 250mm (14 x 10 in.) Minimum Board Size: 50mm x 50mm (2 x 2 in.) Topside Clearance: 25mm (1 in.) Bot

Nordson YESTECH

Practical Dummy Components

Practical Dummy Components

New Equipment | Components

Practical is the exclusive distributor of mechanical samples from Amkor as well as being the leading supplier of samples from Tessera and K&S Flipchip division. Practical prides itself on being the leader in on-time delivery; value added service and

Practical Components, Inc.

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See Your 2024 IPC Certification Training Schedule for Eptac

Wave Soldering 101 Training Course
2024 Eptac IPC Certification Training Schedule

Software for SMT placement & AOI - Free Download.
pressure curing ovens

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Low-cost, self-paced, online training on electronics manufacturing fundamentals