New Equipment | Education/Training
BEST SMT training kits feature REAL circuit boards that represent actual soldering conditions. These training kits feature 0.062in thick multilayer boards which are more representative of the thermal conditions of "real" circuit boards. This SMT tra
QFP and TQFP Dummy Components with daisy chain for solder practice and temperature profiling.
Tamura's Solder Paste RMA Series is a solder paste, which consists of RMA type flux satifies QQ-S-571E and spherical solder powder with very little oxide. So flux residue after soldering becomes high reliable coating with excellent insulation resist
Our Assembly factory could perform reliable manufacturing services for : Surface Mount PCB assembly ; Through hole assembly ; 0201 to 44mm2 - BGA, micro BGA, CSP, fine pitch QFP ; Automated pick and place ; Placement rate - 24,000 cph; Hand build ;
Our Assembly factory could perform reliable manufacturing services for : Surface Mount PCB assembly ; Through hole assembly ; 0201 to 44mm2 - BGA, micro BGA, CSP, fine pitch QFP ; Automated pick and place ; Placement rate - 24,000 cph ; Hand build ;
TM230 solderable conductive adhesives are rapid cure, self-filling, self-leveling and self-soldering adhesives which can be used as die attach adhesives for LED, CSP, QFP, among others, to replace conductive adhesives (Ag) or solder materials such as
Accept a device and either plug into an EPROM emulator or production socket or solder down to a land pattern. Available for DIP, PLCC, SOIC and QFP packages.
-Individual module heat zone design is convenience for maintenance -Adopts ��Star Shape Heater�� that is high solder performance for BGA, QFP components
New Equipment | Soldering Robots
Highly Flexible In Insertion Angles. Vertical inline soldering robot, UNIX-700FV is an ideal for irregularly shaped works into which is hard to insert the tip. The vertical multi-joint is utilized to freely change the head angle and quick operation.
New Equipment | Assembly Services
At the stage where production PCB assembly is being planned, many other factors come into play, particularly Design-for-Test (DFT) and Design-for-Manufacturability (DFM) issues, making sure documentation is current, planning diagnostics tests and mac
