Nordson ASYMTEK’s Fids-on-the-Fly™ option is up to 5.5X faster than the traditional stop-and-capture mode for locating fiducials. Reducing time spent performing this essential, non-dispense routine can increase UPH as much as 35 percent. Fiducials a
Hanwha DECAN S1 Pick and Place Machine Speed: 47,000 CPH PCB Size : L510xW510 Feeder input:120pcs Weight: 1600KG Product description: Hanwha DECAN S1 Pick and Place Machine, Speed: 47,000 CPH, PCB Size : L510xW510, Feeder input:120pcs, Weight: 1600K
Hanwha HM520 MF Pick and Place Machine The Hanwha HM520 MF series mos are a state-of-the-art high-speed modular with extreme flexibility. · Actual productivity is highest among machines of the same class · Optimized to high quality production · Unma
New Equipment | Coating Equipment
The Select Coat® conformal coating machine provides the highest productivity and quality for your automated coating processes. Automate your conformal coating with state-of-the-art process controls, world-leading know-how, expertise in fluid dynam
Feature Products FUJI CP6 24*16mm FEEDER Product Description FUJI CP6 24*16mm FEEDER OFFER CP6 12*8,24*8,24*12,32*12,32*16 FEEDERS if you need, please advise us your P/N,thanks in advance. Supply & repair below fuji parts at a lower price: FUJ
(AutoTronik) BS1400 is a very accurate automatic SMT stencil printer. With the powerful AT-align automatic fiducial finding and PCB board offset adjustment system, you can just press the start key, the PCB alignment and printing process will be fully
Automatic Offline Screen Printer The XH STS stencil and screen printing system was specially developed for printing substrates in thick film applications. The flexible system can be used in a wide number of areas within the hybrid, SMT and solar fi
New Equipment | Solder Paste Stencils
DESEN Classic 1008 SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±25μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum
New Equipment | Solder Paste Stencils
DESEN Hito SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±18μm@,6σ Process Alignment Capability ≥2 Cpk@±8μm@,6σ Cycle Time 7s Maximum Print Area 400mm
New Equipment | Solder Paste Stencils
DESEN Navigator SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±20μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum Print Area 6
