JUKI JM-20 Hybrid Placement Machine Max PCB:410×560mmComponent Size:0603～50mmPlace Speed:15,500 CPHProduct description: JUKI JM-20 Multi Task Platform Hybrid Placement Machine, Max PCB:410×560mm, Component Size:0603～50mm, Place Speed:15,500 CPH
New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
New Equipment | Solder Paste Stencils
Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printin
New Equipment | Solder Paste Stencils
Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printin
Tip Offset Function / Dispensing Z-height Offset / Auto Vision Alignment / Tactile Tip Detect. The SR400V-SPL Laser Vision Dispensing Robot provides High Speed CCD alignment System and Laser Height Sensor, it can be correctly measured surface of wor
The LCS 300 has a working area of 300 x 300 mm and is suited for various applications, such as cutting, drilling, grooving of any material. The LCS is manually loaded, and includes an automatic work piece vision alignment system. The work piece is fi
Standard or Lead Free models available Solder/desolder capabilities PCB Board carrier Hot AIr Blow Through Gun Laser alignment Misc nozzle sizes
User friendly operating software, Ultra stable diode-pumped Nd :YAG green laser, Support Wafer Size : 4,5,6 & 8" wafers, option : 8 to 12" wafers, Absolutely free from damage on the fabricated wafer, High accurate marking position alignment using th
Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu
Eclipse Industries DS-107 Aligner Bonder The DS-107 Aligner Bonder is an ultra-high precision, high or low force aligner bonder. Constructed on a granite platform for superior stability and rigidity, the DS-107 is designed for alignment accuracy of
