New SMT Equipment: quality system integration (Page 12 of 74)

DVS INDIA (P) LTD

New Equipment |  

DVS India (P) Ltd., endeavors to support highly sophisticated electronic equipments required to assemble and test the latest state of the art printed circuit boards, Integrated Circuit Devices, Wafer and Hybrid products for the Indian market. DVS In

DVS India (P) Ltd

Wireless OEM Modules & Stand-Alone Radio Modems

Wireless OEM Modules & Stand-Alone Radio Modems

New Equipment |  

WIRELESS OEM MODULES Low Cost, High-Performance MaxStream designs and manufactures compact 900 MHz and 2.4 GHz, high-performance wireless OEM modules at a perfect price for cost sensitive applications. Extended Range Our proprietary frequency hoppin

MaxStream, Inc.

Wireless OEM Modules & Stand-Alone Radio Modems

New Equipment |  

WIRELESS OEM MODULES Low Cost, High-Performance MaxStream designs and manufactures compact 900 MHz and 2.4 GHz, high-performance wireless OEM modules at a perfect price for cost sensitive applications. Extended Range Our proprietary frequency hoppin

MaxStream, Inc.

High density tungsten alloy(W-Ni-Fe,W-Ni-Cu)

New Equipment |  

This product we supply GE(General Electric company) for 50, 000 pcs per year. We can provide the best quality but the lowest price. Alloy Dimensions (mm) Thickness Width Length W-Ni-Fe 0.1-0.5 50-200 ��100 W-Ni-Cu

Shanghai Leading Metal Technology Co.,Ltd

FINEPLACER® femto2  - Automated Sub-Micron Die Bonder

FINEPLACER® femto2 - Automated Sub-Micron Die Bonder

New Equipment | IC Packaging

Automated Prototype2Production Bonder. The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications in a controlled environment. Fully protecte

Finetech

CrimpCenter 67 HD16 - Fully Automatic Crimping Machine

CrimpCenter 67 HD16 - Fully Automatic Crimping Machine

New Equipment | Cable & Wire Harness Equipment

Overview The CrimpCenter 67 HD16 is a fully automatic swivel arm crimping machine with up to 5 processing stations. It is ideally suited for medium to large cable applications from typically 6 to 16 mm² (10 - 6 AWG). At a maximum feed rate of up to

Schleuniger, Inc.

BGA Socketing Systems

New Equipment |  

Three solutions for virtually any application. BGA Socket Adapter Systems featuring eutectic solder balls and footprints which match BGA device are designed for high volume production applications. Pop-Top� Socket Adapter Systems features integral he

Advanced Interconnections Corporation

Sony TiMMS

Sony TiMMS

New Equipment |  

Sony's TIMMS (Totally Integrated Manufacturing Management System) is a unique integration of demand-chain, factory execution, and new product introduction tools for the electronics circuit board manufacturing industry, focusing on the pull-demand cha

Sony TiMMS

INSIGNUM 4000 Laser - High-End Laser PCB Marking System

INSIGNUM 4000 Laser - High-End Laser PCB Marking System

New Equipment | Other

The high-end system in the series is the INSIGNUM 4000 Laser which exhibits the highest precision at an impressive cycle time of less than 4.8 seconds. The ASYS inline Laser marking system, INSIGNUM 4000 Laser, is used for direct laser marking of so

ASYS Group

CPU-1432

CPU-1432

New Equipment |  

Eurotech SpA. has just released a highly integrated and powerful PC/104Plus CPU module, based on the NS Geode GX1 processor: the CPU-1432. The CPU-1432 is an Embedded Pentium-class Computer in an extremely compact PC/104-Plus form factor that can be

Eurotech S. p. A.


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