New SMT Equipment: re-use (Page 1 of 1)

Subsea Products:<br><br>� Flexible Pipe

Subsea Products:

� Flexible Pipe

New Equipment |  

Technip has pioneered the development of critical products that have permitted the emergence of new concepts in offshore field development. With almost 75% of the market, Technip is the world leader in the design and manufacturing of flexible pipe.

technip group limited

Manual / Motorized PCB Depanelizer 1s

Manual / Motorized PCB Depanelizer 1s

New Equipment | Depaneling

Manual / Motorized Circular Blade Depanelizer (1.2m Led Aluminum Pcb Depaneler) 1. Guide can be adjusted vertically to suit different PCB thickness. 2. Clearance between the circular blades can be precisely adjusted with the knob. 3. Upper and low

HuiKe Tech

ScanWorks® Platform for Embedded Instruments

ScanWorks® Platform for Embedded Instruments

New Equipment | Test Equipment

One platform embedded instruments for validation, test and debug (ScanWorks®) ScanWorks® tools validate, characterize and test chips and circuit boards in development, manufacturing and field service. Structural integrity tests can be re-used over t

ASSET InterTech, Inc.

DFMStream™ Design for Manufacturing Software

DFMStream™ Design for Manufacturing Software

New Equipment | Software

Verify Design and Manufacturing Rules Anytime during the PCB Design Cycle Preparing PCB design data to be released to manufacturing is a critical yet often fragile step in the new product introduction process. Designs that work in a virtual PCB CAD

DownStream Technologies LLC

MARTIN Expert 4.6 - Manual BGA Rework Station

MARTIN Expert 4.6 - Manual BGA Rework Station

New Equipment | Rework & Repair Equipment

The EXPERT 04.6 systems with Hot Air and IR Technology are complete rework stations for manual soldering of SMDs, residual solder removal and dispensing. Soldering profiles can be easily established and supported with the supplied software packet Eas

MARTIN (a Finetech company)

In-circuit Test System - Medalist i3070

In-circuit Test System - Medalist i3070

New Equipment | Test Equipment

Improve both board test coverage and test throughput at in-circuit test with i3070 and i1000D ICT systems that offer one of the best ROICs available in the market today. The Medalist i3070, the next generation In-Circuit Test System, enables 20% mo

Agilent Technologies, Inc.

Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

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