New SMT Equipment: reach (Page 3 of 21)

SynTECH™ No-Clean Solder Paste

SynTECH™ No-Clean Solder Paste

New Equipment | Solder Materials

8 hrs. @ 30–45% RH & 22–25°C ~6 hrs. @ 45–70% RH & 22–25°C Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using 99% isopropyl alcohol (IPA) works well. Storage and Handling Proce

AMTECH

DEGSON Electronics Co. Ltd.

DEGSON Electronics Co. Ltd.

New Equipment | Components

DEGSON has been awarded ISO9001 and ISO14001 management system certifications. The comprehensive product line has more than 1000 models and 12000 types which have been approved by UR, CE, SGS, CB, RoHS, REACH and more.. DEGSON also owns a UL & VDE ap

Electronic Network Inc.

Orange and Black Bakelite Sheet for PCB jigs

Orange and Black Bakelite Sheet for PCB jigs

New Equipment | Materials

Description Bakelite sheet,also called phenolic paper laminated sheet.It is formed by heat pressing after the paper pulp dip into phenolic resin. It is the most common laminated sheet.It is also the most widely used industrial laminated sheet. Chact

Prior Plastic Co., LTD.

NC275B No Clean Liquid Flux

NC275B No Clean Liquid Flux

New Equipment | Solder Materials

NC275B Liquid Flux is a water-based VOC-Free flux that has performance and reliability characteristics equal or superior to many alcohol-based fluxes. A medium-solids/residue flux, NC275B can be used with all common lead-free wave soldering alloys in

AIM Solder

V9 Low-Voiding Solder Paste

V9 Low-Voiding Solder Paste

New Equipment | Solder Materials

V9 No Clean solder paste is formulated for near-zero voiding on BGA, BTC and LED soldering applications. Significant void reduction achievable on all surface finishes including ENIG, ImSn and OSP. V9 exhibits stable print performance on fine feature

AIM Solder

J8 No Clean Jetting Solder Paste

J8 No Clean Jetting Solder Paste

New Equipment | Solder Materials

AIM’s J8 No Clean Jetting Solder Paste is specially formulated for use with jetting equipment providing consistent solder deposits as small as 200μm. J8 is fully compatible with all AIM no clean solder pastes for use in applications where combining j

AIM Solder

H10 Halogen-Free No Clean Solder Paste

H10 Halogen-Free No Clean Solder Paste

New Equipment | Solder Materials

90% on area ratios of 0.50 and a stencil life >8 hours. H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical r

AIM Solder

VERMES Microdispensing Piezo System / SMT Glue Dispensing

VERMES Microdispensing Piezo System / SMT Glue Dispensing

New Equipment | Dispensing

VERMES Microdispensing System MDS 3200+ can dispense SMT adhesive in high precision and in very small dots with low droplets diameter, but still reproducible amounts of dispensed medium. It can reach very high dispensing speeds with a maximum needles

VERMES Microdispensing GmbH

Ebsomat 30-1 Component Counter

Ebsomat 30-1 Component Counter

New Equipment | Component Counters / SMD Counters

Electronic counter for taped axial, radial and SMD taped components. Since May 2008 with new feature of a multiplier to count taped SMD component with sizes of 0402 or even 0201. Furthermore has the EBSO counter new machine diagnostic features and i

EBSO GmbH

Air Filter

Air Filter

New Equipment | Cleaning Equipment

Our air filter is mainly made with foam air filter,aluminium frame,aluminium honeycomb and aluminium mesh. And our foam air filter reaches the UL standards,the flame retardant Grades is UL94V0.Our air filters comply with ROHS standards. Our air filte

China EMI Shielding Materials Co.,LTD


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