New SMT Equipment: reduce bridging (Page 1 of 5)

PTI-500 First Article Inspection Tester

PTI-500 First Article Inspection Tester

New Equipment | Inspection

PTI-500 First Article Inspection Tester 版本号:PTI500V2.0 、 PRODUCT FUNCTIONALITIES ✦ADVANCED SOFTWARE, USER FRIENDLY INTERATIVE OPERATION MINIMALIST DESIGN ✦INTUITIVE VIEW OF TEST RESULT The test result is plotted on individual component which can be

Qinyi Electronics Co.,Ltd

Siemens 12mm 16mm original feeder 00141092

Siemens 12mm 16mm original feeder 00141092

New Equipment | Components

http://www.flason-smt.com/product/Siemens-12mm-16mm-original-feeder-00141092.html Siemens 12mm 16mm original feeder 00141092 SMT Spare Parts Seimens feeder Siemens 12mm 16mm original feeder 00141092 Usage: Seimens pick and place machine Produ

Flason Electronic Co.,limited

Selective Wave Pallets

Selective Wave Pallets

New Equipment | Board Handling - Pallets,Carriers,Fixtures

Stentech has advanced capabilities in machining and drilling composite materials. Stentech can provide a wide range of manufacturing solutions for wave solder pallets that are custom-engineered and manufactured to each client's specifications. The u

Stentech

Wave Solder Pallets

Wave Solder Pallets

New Equipment | Board Handling - Pallets,Carriers,Fixtures

* Provides dimensionally stable support platform for PCB * Protects SMT components from heat or thermal shock * Reduce/eliminate manual labor for hand masking operation, glue dotting, and hand soldering * Reduce solder defects (ex. Bridges and skips)

Shenzhen Sunshine Laser Technology

Sn63/Pb37 Electropure™ High Purity Solder Alloy

Sn63/Pb37 Electropure™ High Purity Solder Alloy

New Equipment | Solder Materials

Sn63/Pb37 Electropure™ is a high purity alloy that is composed of 63% tin and 37% lead. Electropure is alloyed in a proprietary method that results in a low drossing, high wetting solder. The Electropure process reduces suspended oxides in the solde

AIM Solder

SAC305 Lead-Free Solder Alloy

SAC305 Lead-Free Solder Alloy

New Equipment | Solder Materials

SAC305 is a lead-free alloy that contains 96.5 % tin, 3% silver, and 0.5% copper. This alloy falls under the JEIDA recommendation for lead-free soldering. When used in wave soldering, AIM’s SAC305 bar solder offers far superior fluidity as compared t

AIM Solder

Nano-ProTek - Stencil Coating

Nano-ProTek - Stencil Coating

New Equipment | Solder Paste Stencils

DEK’s Nano-ProTek technology is a permanent, hydrophobic nano-coating that, when applied to the bottom-side of the stencil foil and stencil aperture walls, minimizes solder paste’s ability to stick to the foil surface. Up to a 10X increase in the num

ASM Assembly Systems (DEK)

NanoSlic™ Gold Stencils

NanoSlic™ Gold Stencils

New Equipment | Printing

NanoSlic™ Gold is our top of the line spray on coating applied to our UltraSlic™ solder paste stencil, which gives previously unseen performance benefits in transfer efficiency. The NanoSlic™ Gold coating also gives the benefits of improved under-ste

Fine Line Stencil, Inc.

Slic Blade™ SMT Squeegee Blades

Slic Blade™ SMT Squeegee Blades

New Equipment | Printing

Fine Line Stencil's unique Slic Blade™ process uses electroformed nickel to form a hard, very smooth surface with extremely low surface energy (high lubricity). Solder paste readily sticks to most metal surfaces, even coated blades, due to metal's hi

Fine Line Stencil, Inc.

Nikko Power Cyclone 3D PCB Cleaner

Nikko Power Cyclone 3D PCB Cleaner

New Equipment | Cleaning Equipment

Inline, quickly and efficiently removes dust and particulates from PCB surface before solder application. Recently, there has been a dramatic increase in the number of customers implementing PCB cleaners before solder application in the mounting pr

Nix of America

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