New Equipment | Solder Materials
AIM’s J8 No Clean Jetting Solder Paste is specially formulated for use with jetting equipment providing consistent solder deposits as small as 200μm. J8 is fully compatible with all AIM no clean solder pastes for use in applications where combining j
New Equipment | Solder Materials
AIM introduces M8 Solder Paste, a high reliability no clean paste for use with SAC305, REL22, REL61, and Sn/Pb alloys. M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly success
New Equipment | Solder Materials
Cobar XF3 Solder Paste Completes SN100C Solder Materials System; Superior Reflow, Printing Performance over SAC Alloys. XF3 is a lead-free solder paste, developed to accommodate extended reflow profiles without use of nitrogen. XF3 completes the
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Durastone wave pallet material with good price Overview: 1, Durostone materials are reinforced glass fibre composites. 2, It have been proved to be suitable for all processes during PCB assembly such as SMT reflow and wave soldering processes.
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Black Durostone alternative for selective solder pallets Overview: Black Durostone alternative is made from anti-static black composite material and reinforced fiberglass. Properties: 1, Its excellent machining properties enabling
New Equipment | Solder Materials
With its tin-copper-nickel-germanium alloy, SN100C is a popular lead-free wave soldering alloy. Although initially developed to address the need for an economical wave solder, it has since been found that its properties make SN100C ideal for reflow a
New Equipment | Solder Materials
NC254 is a lead-free and tin-lead compatible solder paste that offers very good wetting, clear residues and has shown to eliminate voiding under micro-BGAs. NC254 has been developed to offer extremely broad process windows for printing, wetting and
Inclusions/voids will be reduced up to 99% Vacuum process can be switched on or off Nitrogen and air soldering possible Double sided PCB possible Pass through height: 30 mm (top and bottom) Small PCB with carrier Setting parameter: Time until sub-pre
Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 lead-free soldering paste SMT Solder Paste Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 flux solder paste Product description: Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 is a no-clean, lead-free,
Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 lead-free soldering paste SMT Solder Paste Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 flux solder paste Product description: Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 is a no-clean, lead-free,
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