Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to
New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
New Equipment | Solder Materials
Solves: QFN Voiding | Head-in-Pillow | Graping Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by t
New Equipment | Solder Materials
Superior Drop Shock Performance AND Thermal Cycling Reliability Current Industry Dilemma The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Additionally, all these SAC alloys are far inferior to
Inspection System for Die Casting, Automotive Components, Defense Components, Cultural Assets and Large Products Appropriate for the inspection of medium•large size components and detection of surface structure and defects (inside voids and cra
(Albany, NY) 1/2/2018 – YINCAE Advanced Materials has recently developed a reflowable (no flow) underfill: SMT 160. This product is designed to eliminate capillary underfills, simplify the assembly process, combine soldering and underfilling in SMT p
(Albany, NY) 1/3/2018 – YINCAE Advanced Materials has recently developed a low temperature curable reflowable (no flow) underfill: SMT 160L. This product is designed to eliminate capillary underfills, simplify the assembly process, combine soldering
Major applications: PCBA BGA/IC LED Aliminum die casting Battery connector inspecting 1. Semiconductor package 2. Electronic connector module. 3. Original Package 4. Aerospace components 5. Medical appliances 6. Automation components X-ray In
With the EXOS 10/26, Ersa offers a vacuum reflow soldering system with eleven heating zones, three heating circuits for the vacuum chamber and four cooling zones for extremely voidfree connections in electronics production. The absolute highlight
At the cutting edge of X-ray inspection performance, Quadra 7 shows you features and defects as small as 0.1µm, non destructively. Quadra 7 is the X-ray inspection and failure analysis tool of choice in a wide range of industries, including electron
