Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
Full-featured and compact benchtop dispense system robot offering accurate and repeatable dispense results! A benchtop dispense system does not mean "no features". The Catalina benchtop dispense system is a full-featured platform with these standard
New Equipment | Solder Materials
Automated solder dross recycle machine tin slag separator use a hopper to load hot dross,then recover solder into a solder tray in the form of ingots that can be placed back into the solder pots of tin slag recycle system;it then deposits the spent d
New Equipment | Solder Materials
Automated solder dross recycle machine tin slag separator use a hopper to load hot dross,then recover solder into a solder tray in the form of ingots that can be placed back into the solder pots of tin slag recycle system;it then deposits the spent d
New Equipment | Education/Training
In this One-Day class you will learn successful techniques to re-ball BGA Components. Both Lead and Lead Free Solder Balls will be covered. The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the
New Equipment | Soldering Robots
PLC Action and PC Picture Processing Optional Quickly Laser Tin-Ball Spraying Soldering Machine Product Parameter : Feeding Way Carry in or out track or on-line type or jig, single or double station Lase
New Equipment | Rework & Repair Services
BGA Reballing and Solder Bumping for all types of SMD's Lead, Lead Free and Solder Alloy Conversion. Package types include but are not limited to: PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
New Equipment | Soldering Robots
Feeding Way: Carry In Or Out Track Or On-line Type Or Jig, Single Or Double Station Laser Parameter: Power Optional 50-200w Wave Length : 1070 Pattern: Constant Or Pulse Solder Ball Size: ø0.25MM Controlling Way: PLC Action
New Equipment | Education/Training
Solder Training and Solder Certification Courses Taught in Accordance With IPC Soldering Guidelines. We offer a variety of customized courses set up specifically for our customers requirements. An example would be our combination type certificate t
