SAMSUNG Pick and Place Machine Applicable Components: 0402~5050 Component available: Minimum 01005-38*38*8.5mm (48*48 Optional) Weight: 1400KG Samsung SMT Pick and Place Machine Product description: SAMSUNG Pick and Place Machine,Applicable Co
SAMSUNG Pick and Place Machine Applicable Components: 0402~5050 Component available: Minimum 01005-38*38*8.5mm (48*48 Optional) Weight: 1400KG Samsung SMT Pick and Place Machine Product description: SAMSUNG Pick and Place Machine,Applicable Co
SAMSUNG Pick and Place Machine Applicable Components: 0402~5050 Component available: Minimum 01005-38*38*8.5mm (48*48 Optional) Weight: 1400KG Samsung SMT Pick and Place Machine Product description: SAMSUNG Pick and Place Machine,Applicable Co
PCB Pick and Place Machine Panasonic CM602 Pick and Place Machine Mounting Speed: 100,000 CPH Application components:0402 (01005) Panasonic CM602 Product description: PCB Pick and Place Machine,Panasonic CM602 Pick and Place Machine,Mounting S
SMD Pick and Place Machine Applicable Components Board size:330×250mm Feeder inputs:20 placement capacity: 22,500CPH Product description: SMD Pick and Place Machine INQUIRY SMD Pick and Place Machine Product Specifications:
JUKI Pick and Place Machine Applicable Components: 0201~5050 Board size:50×50-650×370mm Feeder inputs:max.112 placement capacity:47,000 CPH Product description: JUKI Pick and Place Machine: 0201~5050,Board size:50×50-650&time
Small Pick and Place Machine Yamaha YG100 Pick and place machine 1,650(L)x1,562(W)x1,850(H)mm Patch speed: 24,000 CPH Weight: 1,630kg Product description: Small Pick and Place Machine Small Pick and Place Machine Products Description:
Small Pick and Place Machine Yamaha YG100 Pick and place machine 1,650(L)x1,562(W)x1,850(H)mm Patch speed: 24,000 CPH Weight: 1,630kg Product description: Small Pick and Place Machine,Yamaha YG100 Pick and place machine, 1,650(L)x1,562(W)x1,85
New Equipment | Assembly Services
Ideal for hand-held to large storage devices, Rigid Flex Circuits and Assemblies combine the benefits of flexible copper circuitry and rigid PCB circuitry into a unitized power and signal solution for superior reliability, system cost savings and opt
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
