New SMT Equipment: reflow and solder and faiulre (Page 1 of 2)

Ricocel ES-3261A Sheet for wave solder pallet and reflow pallet

Ricocel ES-3261A Sheet for wave solder pallet and reflow pallet

New Equipment | Reflow

Description Ricocel is made by fiber glass cloth and high temperature resin. It is an ideal material for solder pallets, wave solder pallets, SMT solder pallets, SMT solder fixtures, selective solder fixtures and other specialty soldering fixtures.

Prior Plastic Co., LTD.

www.reflowsystems.com ECOSOLD and CORA reflow ovens

New Equipment |  

reflowsystems.com manufactures and distributes three series of ovens to offer a perfect fit in size and price for every production need: 1) CORA 450 and 250 are combining not only COnvection and RAdiation to guarantee stressfree soldering of BGAs eve

reflowsystems

SMT reflow oven R50CD with mesh belt and pin chain

SMT reflow oven R50CD with mesh belt and pin chain

New Equipment | Soldering Robots

Model  R50CD (Computer) Heating zones  Upper 5/lower 5 Length of heating zone 1730mm PCB width  Chain 300mm, mesh 350mm Conveyor chain width range  50-300mm PCB direction  L→R  or (R→L) Chain fixing Front fix(back fix is optional) Conveyor hei

Beijing Glichn S&T Development Co.,Ltd

SIPAD boards delivered with solid solder and adhesive flux protected by release paper

SIPAD boards delivered with solid solder and adhesive flux protected by release paper

New Equipment | Materials

SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards are t

SIPAD Systems Inc.

Reflow Soldering and Bonding Heads

New Equipment |  

This family of three air-actuated heads provides accurate force setting from 0.5lbs to 100 lbs. Extruded head mounts and built-in thermode co-planarity adjustment mean easy systems integration.

Unitek Equipment

Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

Fixtures and Tooling for PCB Assembly

Fixtures and Tooling for PCB Assembly

New Equipment | Board Handling - Pallets,Carriers,Fixtures

WAVE SOLDER PALLETS, PROCESS CARRIERS, REFLOW FIXTURES, SELECTIVE SOLDER FIXTURES, SURFACE MOUNT CARRIERS, CONFORMAL COATING FIXTURES, ADJUSTABLE FIXTURES, CUSTOM TOOLING AND FIXTURES, MACHINING SERVICES WWW.EMCGTI.COM     Check out our FACEBOOK Pa

EMC Global Technologies, Inc.

PHM Hot Bar Soldering and Bonding Machines

PHM Hot Bar Soldering and Bonding Machines

New Equipment | IC Packaging

Fancort's Hot Bar Bonding and Soldering machines are easy to use, robust and economical for bonding flex to rigid assemblies such as Flex to PCB, LCD-Flex to PCB, Flex to LCD, HSC to LCD, HSC to PCB. Microprocessor based controller provides precis

Fancort Industries, Inc.

Used and New SMT machines & parts

Used and New SMT machines & parts

New Equipment | Pick & Place

We can offer the following prodcuts in the field of secondhand SMT machine and parts - Used SMT equipment, secondhand SMT pick and place machines, - SMT pick and place machine spare parts, - Used and new SMT feeders for all machine types, - used AOI/

Dinex LTD. Hungary

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