Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
New Equipment | Rework & Repair Equipment
No need of nozzles, no airflow during re-flow process. Use non-contact infrared temperature sensor to measure temperature real-timely, and achieve closed loop control of temperature during rework process, especially suitable for lead free process.
New Equipment | Rework & Repair Equipment
The X-1 Precision SMT/BGA Rework Station is a flexible system designed for manual alignment and placement or removal of BGA, microBGA, Flip Chip, CSP and other surface mount electronic components with precisely controlled solder reflow profiles. The
New Equipment | Rework & Repair Equipment
Production BGA Installation & Rework WITHOUT the Expensive Nozzles! The IR 3000 is the most advanced BGA rework system available on the market today. It can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD's. Featuring a 500W in
New Equipment | Rework & Repair Equipment
Infrared BGA & SMT Rework at a Price that Can't Be Beat! The IR 1000 is a low-cost, remarkably flexible and effective rework system, capable of installing and removing passives, QFP's, SOIC's, PLCC's, MLF's, LCCC's, TSOP's, QFN's and BGA's. It is id
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Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,
New Equipment | Rework & Repair Equipment
The AT-707 series BGA Rework Stations are semiautomatic machines featuring spilt vision optics and precise software process control. Systems are used to rework various devices such as BGA’s, CSP’s, QFN’s, QFP’s, and other complex SMD’s in both Lead-F
New Equipment | Rework & Repair Equipment
Cost Effective Rework of Medium Size Boards The FINEPLACER® coreplus is a compact, yet versatile rework system that offers a level of professionalism that exceeds its attractive price. The system offers proven rework technology for a wide spectrum
New Equipment | Rework & Repair Equipment
20 X 20 in. (508 mm X 508 mm) Min. Component Size 0.005" (0.12mm) Placement 0.0005" (12μ) mean + 3σ Compliance CE, ANSI/UL 61010, CAN/CSA C22.2 Top Heater 2.0 kW Site Heater 1.0 kW Bottom Heater 5.6 kW Field-of-View 2.6" (65 mm) Square Carry