New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Reflow Rider is designed for the new reflow ovens with edge rail conveyors and no conveyor belt. Reflow Rider's side rails adjust independently for height, to adapt easily to the new oven configurations including center board support rails, edge grip
Classic PCB Profiling tools are used to create a repeatable thermal process that meets the specifications required by the solder paste and or component manufacturers. Only by profiling do you have any idea of what the actual temperatures are on the c
New Equipment | Cleaning Agents
CYBERSOLV® C8508 is the latest generation spray cleaner for reflow ovens and general equipment maintenance cleaning. CYBERSOLV® C8508 has been tested on the toughest baked on flux residues with great success and has proven effective on the latest lea
EMC Global Technologies At EMC Global Technologies we manufacture fixtures and tooling for the processing of printed circuit board assemblies. FIXTURES Wave Solder Pallets Dedicated or Adjustabl
New Equipment | Education/Training
Bob Willis has an extensive range of training videos available online. The complete video collection is available to view online for a fixed fee, based on a six month period. After purchase you are provided with links to each of the online videos for
Tachyon-100G laminate materials are designed for very high-speed digital applications up to and beyond speeds of 100 Gb/s. Tachyon 100-G materials exhibit exceptional electrical properties that are very stable over a broad frequency and temperature
New Equipment | Cleaning Agents
MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302
New Equipment | Wave Soldering
The modular system for medium production volumes, to be soldered in ambient atmosphere or with local nitrogen inertion of the solder bath. With the wave soldering system PowerWave, SEHO consequently realized a machine concept that offers a remarkab
New Equipment | Wave Soldering
For medium production volumes with demanding quality requirements. The smallest full tunnel nitrogen wave soldering system from SEHO. The wave soldering system SEHO PowerWave N2 is designed for medium to large production volumes and is ideally sui
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