Suppliers of New and Reconditioned Equipment for the Electronics Assembly Industry. We are the exclusive representative of Hitachi High Technology in Mexico and the Texas Border. We also sell a complete line of new economical assembly equipment
PRO 1600 is a full forced air / nitrogen convection reflow oven that covers only 31" x 31" of floor space. It has been designed for reflow soldering of even the most challenging applications including, high thermal mass and lead free assemblies. PRO
New Equipment | Board Handling - Conveyors
Application: For unloading printed circuit boards from wave solder and reflow oven. Specifications: IPC SMEMA 9851 Compliant (2) Cooling Fan Banks Mitsubishi Melsec PLC Panasonic Motors and Drives Light Tower 18" Width / 1 Drive Section
PRO 1600-B is a benchtop full forced air convection reflow oven. It has been designed for reflow soldering of even the most challenging applications including, high thermal mass and lead free assemblies. PRO 1600-B is very flexible in terms of profil
1) Non contact Coplanarity Measuring Module with Reflow Oven 2) Coplanarity measurement for lead free & Hogh Temperature environment. 3) Due to rapid growth of "Lead free solder" usage, surface mounting parts are requested to be heated higher and be
All in One N2 Reflow Oven. A next generation reflow oven that realizes ultra-low power consumption, the lowest N2 consumption and a high efficiency flux collecting system complying CO2 emission regulations. N2 Generator Fixing Type Easy M
Heating system: Quantities of heating zones :Top8 /bottom8 Length of heating zones :3100mm Quantities of cooling zones: 2 Conveyor: Maximum width of PCB :450mm (can be customized) Rail adjustment range :50~450mm Conveyor direction :R t
BTU’s Pyramax™ family of high-throughput thermal processing systems is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. Pyramax™ systems provi
The MSL baking process at OX3 Corporation, (�MSL� stands for Moisture Sensitivity Level), is in accordance with IPC and JEDEC Standard "J-STD-033A," the joint industry standard for semiconductor handling, packing, shipping and the use of moisture/ref
New Equipment | Solder Materials
As the world's leading developer of advanced solder paste materials, Henkel delivers decades of technology and expertise for optimized process performance. With ground breaking new formulations to provide an easy transition to lead-free as well as pr
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