Compact machine technology for small and medium-sized production series with convincing price-performance-ratio. Attractive Performance - Attractive Design - Attractive Price With a heating zone length of 1850 mm or 2350 mm the convection reflow
The only portable reflow oven optimizers with statistical process control (SPC). Regardless of the recipe and what your reflow oven's controls indicate, what your PCB actually experiences at board-level as it goes through the oven can be SIGNIFICANT
New Equipment | Board Handling - Pallets,Carriers,Fixtures
The award winning KIC profilers provide accurate and quick profiling, as well as optimum oven set up. Facilitates Reflow Profiling Works on Edge Conveyors with and without Center Board Support Profile Low Clearance Ovens Accomodates Extra Wide
Ideal for in-house Rapid PCB Prototyping The ProtoFlow S is LPKF's premiere convection oven, ideal for lead-free reflow soldering, meeting the stringent demands of rapid PCB soldering applications. The ProtoFlow S features even heat distribution, e
Near Equilibrium Hot Gas Heating makes the CUREFLOW series the only choice for SMT Convection reflow and curing applications. 3 models to choose from.
The Sirocco an economical, in-line reflow oven using C3, full convection, laminar heat transfer technology. Ideal for medium to high volume production, Sirocco ovens offer minimal variation in temperature across the conveyor.
-Individual module heat zone design is convenience for maintenance -Adopts ��Star Shape Heater�� that is high solder performance for BGA, QFP components
rehm's "Compact" and "SMS" series of full convection reflow ovens is now available in North America. Modular design principles allow virtually any combination of heating and cooling sections, as well as conveyor and process-atmosphere sub systems.