THE HOTFLOW SERIES: INDIVIDUALLY TAILORED TO YOUR NEEDS. Outstanding thermal performance, highest machine uptime and lowest operating costs have been the convincing advantages of Ersa reflow soldering systems for many years already. The HOTFLOW 3
Cost-effective batch reflow oven utilizing forced air convection heating technology with individual time and temperature controls makes profile set up quick and easy. The GF-B-HT is a high temperature model capable of lead and lead-free soldering.
Accurate 16 channel temperature profiling system for use in reflow soldering and wave solder process verification. The equipment offers class leading price,dimensions and performance, RF telemetry and ease of use.For full details visit the 'PROfile
Training provided on SMT Assembly Process, Printing and Reflow Technology, Effective soldering and Reworking for in-house training.
New Equipment | Education/Training
All Bob Willis training workshops are run on site at your manufacturing facility, conference or exhibition venues Worldwide. We offer the largest range of theory and hands on workshops in the industry. The content of any workshop may be modified to s
3°C/sec. Excellent ROI (Return of Investment). Wide process window for “universal profiling”. 50% less Nitrogen consumption than other systems.
New Equipment | Board Handling - Storage
Prevent your components from micro-cracking during reflow with proper Ultra-Low Humidity Storage. DXU models of maintain1%RH Wide range of cabinets including UL/C models Conforms to IPC/JEDEC J-STD 033B.1 Dehumidifies ICs to prevent micro-crack
NIX OF AMERICA has capability to customize label sizes with variety of materials based on customer’s criteria and offers competitive price with great value. We also offer anti-static PCB labels to ensure safety of customer’s board. ROHS Compliant
All SMT reflow soldering systems guarantee optimum process reliability thanks to innovative technology, and feature the following advantages: Special nozzle system for optimum heat transfer Sophisticated control concept for lowest possible energy a
Versatile reflow oven for medium volume soldering (leadfree or leaded solder). 400 mm process width. Integrated microprocessor for profile control and storage. Extra high air volume for perfect soldering of complex boards. 5 zone reflow oven 400
