New SMT Equipment: reflow profile dummy bga part (Page 1 of 1)

PACE IR 3000 Infrared BGA/SMT Rework System

PACE IR 3000 Infrared BGA/SMT Rework System

New Equipment | Rework & Repair Equipment

Production BGA Installation & Rework WITHOUT the Expensive Nozzles! The IR 3000 is the most advanced BGA rework system available on the market today. It can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD's. Featuring a 500W in

PACE Worldwide

HEPCO 9400-1 BGA Solder Sphere Placement System

HEPCO 9400-1 BGA Solder Sphere Placement System

New Equipment | Pick & Place

The Model 9000 operates using a self-contained vacuum system to secure the BGA component while transferring the desired pattern of solder sphere's in a full array. Alignment is achieved through precision pins and specific tooling for ease of use, re

HEPCO, Inc.

AT-707 Series BGA Placement & Rework Stations

AT-707 Series BGA Placement & Rework Stations

New Equipment | Rework & Repair Equipment

The AT-707 series BGA Rework Stations are semiautomatic machines featuring spilt vision optics and precise software process control. Systems are used to rework various devices such as BGA’s, CSP’s, QFN’s, QFP’s, and other complex SMD’s in both Lead-F

Advanced Techniques US Inc. (ATCO)

RE-7500

RE-7500

New Equipment | Printing

- Flexible uses for all different kinds of Components like SMD, BGA, CBGA, CCGA, CSP, QFN, MLF, PGA and All Epoxy undefiled BGA .. etc . - Recommended for reworking All Plastic parts, PTH, Sockets, Connectors and Metal Shields . - Complete reworking

Jovy Systems Limited

PACE TF 1800 BGA/SMD Rework System for Standard Boards (up to 12

PACE TF 1800 BGA/SMD Rework System for Standard Boards (up to 12" x 12")

New Equipment | Rework & Repair Equipment

Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,

PACE Worldwide

AT-GDP Series - BGA / QFN / SMT Placement & Rework Stations

AT-GDP Series - BGA / QFN / SMT Placement & Rework Stations

New Equipment | Rework & Repair Equipment

The AT-GDP Series BGA Rework Systems are semi-automatic machines featuring the latest vision and process control technologies. Lead-Free applications consisting of complex components such as BGA’s, CSP’s, QFN’s, Flip Chips, and other SMD’s are rework

Advanced Techniques US Inc. (ATCO)

SIPAD Solid Solder Deposit (SSD)

SIPAD Solid Solder Deposit (SSD)

New Equipment | Other

SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards a

SIPAD Systems Inc.

Philips/Yamaha FS2 8x2mm feeder (for 0402)

Philips/Yamaha FS2 8x2mm feeder (for 0402)

New Equipment | Pick & Place

SMT-precise designs and manufactures quality yamaha FS2 feeder professionally Hanwha Pick and Place Machine:XM520, HM520, HM510, Excen PRO, Decan S2, Decan S1, SM485P, SM482 Plus, SM481 Plus, SM471 Plus Yamaha Pick and Place Machine: YRM20DL, YRM20,

SMT-precise co.,Ltd

  1  

reflow profile dummy bga part searches for Companies, Equipment, Machines, Suppliers & Information

Best SMT Reflow Oven

World's Best Reflow Oven Customizable for Unique Applications
Blackfox IPC Training & Certification

High Throughput Reflow Oven
Global manufacturing solutions provider

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...


Original SMT Feeders and spares for Panasonic, Fuji , Yamaha, Juki , Samsung