LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &
Middle Size Lead Free SMT Reflow Oven for LED A600 Model: A600 MID-sized Lead-free Reflow Oven(6-zone) Brief: Lead-free reflow soldering Heating System > Eight groups of top and bottom forced hot air convection heating zones. > Patented heati
25.0µm (>1 mil) Packing: Inner packing: vacuum packing/plastic bag Outer packing: standard carton packing Shape tolerance: ±0.13 Hole tolerance: PTH: ±0.076 NPTH: ±0.05 With UL, SGS and RoHS marks Special requirements: buried and blind via +
explorFlow - SMT reflow system,Made by Vanstron Automation A high-quality reflow oven for medium/large production in the SMT industry. Fully prepared for the lead-free soldering process, this oven attains excellent thermal uniformity. Main Featu
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Our high quality Board Carriers securely hold small to medium sized circuit boards of almost any shape and up to six Temprobes™ for thermal profiling. All Board Carriers Feature four adjustable arms. Two of the arms can be pivoted and locked to po
Don't Sacrifice PCBs for Profiling Double Sided Thermally Conductive Tape Used for Attaching Thermocouples to PCBS. Non-destructive TC attachment Reliable TC readings No waiting for curing or soldering Fast, easy setup Sold in 1
New Equipment | Rework & Repair Equipment
Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,
*Controlled convection with N2 option. *1-profile system. *More than 2 m process length. *Multijet air flow technology for excellent zone separation. *Volumetric and temperature controlled heat transfer *Highly stable temperature environment *C
*Controlled convection with N2 option. *1-profile system. *More than 2 m process length. *Multijet air flow technology for excellent zone separation. *Volumetric and temperature controlled heat transfer *Highly stable temperature environment *C
Versatile reflow oven for medium volume soldering (leadfree or leaded solder). 400 mm process width. Integrated microprocessor for profile control and storage. Extra high air volume for perfect soldering of complex boards. 5 zone reflow oven 400
