New SMT Equipment: reflow profile for double side (Page 1 of 1)

LED Reflow Oven for 3W High Power LED

LED Reflow Oven for 3W High Power LED

New Equipment | Reflow

LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Middle Size Lead Free SMT Reflow Oven for LED A600

Middle Size Lead Free SMT Reflow Oven for LED A600

New Equipment | Reflow

Middle Size Lead Free SMT Reflow Oven for LED A600 Model: A600 MID-sized Lead-free Reflow Oven(6-zone) Brief: Lead-free reflow soldering Heating System > Eight groups of top and bottom forced hot air convection heating zones. > Patented heati

I.C.T ( Dongguan ICT Technology Co., Ltd. )

KIC Aluminum Tape - Solution for Reliable Thermocouple Attachment

KIC Aluminum Tape - Solution for Reliable Thermocouple Attachment

New Equipment | Components

Don't Sacrifice PCBs for Profiling Double Sided Thermally Conductive Tape Used for Attaching Thermocouples to PCBS. Non-destructive TC attachment Reliable TC readings No waiting for curing or soldering Fast, easy setup Sold in 1

KIC Thermal

ERSA 7 Hotflow Oven w/ N2 Option

ERSA 7 Hotflow Oven w/ N2 Option

New Equipment |  

*Controlled convection with N2 option. *1-profile system. *More than 2 m process length. *Multijet air flow technology for excellent zone separation. *Volumetric and temperature controlled heat transfer *Highly stable temperature environment *C

globalsystems

ERSA 7 Hotflow Oven w/ N2 Option

New Equipment |  

*Controlled convection with N2 option. *1-profile system. *More than 2 m process length. *Multijet air flow technology for excellent zone separation. *Volumetric and temperature controlled heat transfer *Highly stable temperature environment *C

globalsystems

RO400FC Full Convection Reflow Oven

RO400FC Full Convection Reflow Oven

New Equipment | Reflow

Versatile reflow oven for medium volume soldering (leadfree or leaded solder). 400 mm process width. Integrated microprocessor for profile control and storage. Extra high air volume for perfect soldering of complex boards. 5 zone reflow oven 400

ESSEMTEC AG

SEHO GoReflow - Compact Reflow Oven

SEHO GoReflow - Compact Reflow Oven

New Equipment | Reflow

Compact machine technology for small and medium-sized production series with convincing price-performance-ratio. Attractive Performance - Attractive Design - Attractive Price With a heating zone length of 1850 mm or 2350 mm the convection reflow

SEHO Systems GmbH

Tachyon®-100G Low-loss Laminate Material For High-speed Digital Applications

Tachyon®-100G Low-loss Laminate Material For High-speed Digital Applications

New Equipment | Materials

Tachyon-100G laminate materials are designed for very high-speed digital applications up to and beyond speeds of 100 Gb/s. Tachyon 100-G materials exhibit exceptional electrical properties that are very stable over a broad frequency and temperature

Isola Group

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