New Equipment | Solder Paste Stencils
Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printin
General card design, component packages, equipment, component preparation, solder paste, stencil printing, component placement, reflow profiling, adhesives and all other related topics
TR360 is the simplest solution, the most compact-size and cost-efficient reflow oven, but it is functional over your expectation, fully like the large full-size reflow oven. Please see details below: 1). It is suitable for both leaded and lead-fr
> ◇Windows XP operation software with Chinese and English alternative.Whole system under integration control can analyze and display the failure.All production data can be saved completely and analyzed. ◇PC&Siemens PLC controlling unit with stable
> ◇Windows XP operation software with Chinese and English alternative.Whole system under integration control can analyze and display the failure.All production data can be saved completely and analyzed. ◇PC&Siemens PLC controlling unit with stable
> ◇Windows XP operation software with Chinese and English alternative.Whole system under integration control can analyze and display the failure.All production data can be saved completely and analyzed. ◇PC&Siemens PLC controlling unit with stable
New Equipment | Assembly Services
Unique advanced long-time heating system 1. Equipped with high efficiency and energy saving Swedish NI-CR heating tube, radiation power peak wavelength 4 UM, with surface reflector, high thermal efficiency, temperature rise speed, the forced air cir
1.Modularized heating system. 2.Nitrogen protection system. 3.External high-power water-cooling system. 4.Flux Collecting system.
New Equipment | Wave Soldering
V-soltes WS series armed with hot air preheating, nitorgen packaging, dual wave soldering pot and external high power cooling system is proved to be the exact solution to its high process requirement for SMT/AI. - Flux capacity：6L； - Flux runoff：10-
