PRO 1600-B is a benchtop full forced air convection reflow oven. It has been designed for reflow soldering of even the most challenging applications including, high thermal mass and lead free assemblies. PRO 1600-B is very flexible in terms of profil
Formic Acid Horizontal Reflow Oven H5 Features Formic Acid Horizontal Reflow Oven H5: 1, high vacuum degree: 0.01 mbar high vacuum, vacuum degree of cavity numerical real-time display, and can control and adjust 2, vacuum pumping speed, after 50 m
High Value, Flexible Inspection For All Applications. The QX150i™ AOI system offers high value and high flexibility for all applications and is ideally suited for pre-reflow and selective solder inspection. The Strobed Inspection Module (SIM), the c
BTU’s Pyramax™ family of high-throughput thermal processing systems is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. Pyramax™ systems provi
SRF30 - Nitrogen Reflow Oven SRF70 - Air Reflow Oven Heating and cooling function applicable for the lead-free soldering of various boards By increasing the number of heating zones and adopting reflow soldering system, the temperature prof
New Equipment | Solder Materials
High temperature composite material for wave solder pallet and reflow soldering pallet
New Equipment | Solder Materials
Superior Drop Shock Performance AND Thermal Cycling Reliability Current Industry Dilemma The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Additionally, all these SAC alloys are far inferior to
170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
Petroferm offers a complete line of aqueous and semi-aqueous cleaning chemistries for use in batch and inline spray-in-air cleaning equipment. These cleaning materials are used for defluxing (removing post reflow solder paste residues) circuit boards
Lead-Free Desktop Reflow Oven with tempereture cure T200N+ Lead-Free Desktop Reflow Oven with tempereture cure T200N+ Product Description Product Description: T200N+=nitrogen lead free reflow oven T200N+temperature tester T200N+ is not o
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