New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
All SMT reflow soldering systems guarantee optimum process reliability thanks to innovative technology, and feature the following advantages: Special nozzle system for optimum heat transfer Sophisticated control concept for lowest possible energy a
San Diego Exchange's staff members with years of experience in the Electronic Assembly Industry are waiting to help you find the solution to your assembly needs. We have former OEM personnel that will add their expertise to yours, so that your next c
THE HOTFLOW SERIES: INDIVIDUALLY TAILORED TO YOUR NEEDS. Outstanding thermal performance, highest machine uptime and lowest operating costs have been the convincing advantages of Ersa reflow soldering systems for many years already. The HOTFLOW 3
HELLER CONVECTION REFLOW 1912EXL 12 HEATED ZONE, & 2 COOLING ZONE DOM 2007, 22K HOURS FIXED FRONT EDGE RAIL & MESH BELT RIGHT TO LEFT* LEAD FREE 480 VOLTS 100 AMPS 3 PHASE 232” LONG Thank you for helping make Quality Manufacturing Services I
First of all, It is so pleasure to contact your company We,TSM soldering machinery,are looking for distributor covering regional country for ele/semicon.industrial assembly application Let us introduce ourself shortly,if you can share business oppor
Characters: 1.Intelligent Sirocco Reflow Oven,heating more reliable and average 2.Total have five temperature zones,support adjust each zones temperature by yourself 3.First:Fast preheat zone Second:Soldering zone Third:Drying zone Fourth/Fifth:Bo
New Equipment | Assembly Services
From prototype to production and quick-turns to standard and scheduled deliveries, let our highly competent in-house PCB assembly operation handle all of your assembly needs. Although we feature high-speed pick and place machines, multi-zone reflow
Lead Free 4 Top 4 Bottom plus 1 cooling zone Vintage: 2003 Specs: Substrate size(min/max): L100xW25mm/ L250xW75mm Substrate Height : 10mm max (upper) Transfer method : wire belt conveyor method Transfer height : 900 A+/- 20
Profitable Batch Reflow Oven win7 Operating System T200C+ Product Description: The lead-free reflow oven T200C+ = Reflow oven T200C + temperature curve tester. T200C+ does not only have a lead free welding function, but also has a temperature meas