Introducing the ezCLIP universal stop clip for PCB magazine racks. The ezCLIP system was created to allow electronics manufacturers who manually load/unload PCB magazine racks a simple way to distinguish required spacing between boards and to prevent
New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
TR360 is the simplest solution, the most compact-size and cost-efficient reflow oven, but it is functional over your expectation, fully like the large full-size reflow oven. Please see details below: 1). It is suitable for both leaded and lead-fr
New Equipment | Soldering Robots
Model R50CD (Computer) Heating zones Upper 5/lower 5 Length of heating zone 1730mm PCB width Chain 300mm, mesh 350mm Conveyor chain width range 50-300mm PCB direction L→R or （R→L） Chain fixing Front fix(back fix is optional) Conveyor hei
New Equipment | Solder Materials
16 hours), and abandon time (>8 hours) Improved paste transfer efficiency Printing: Suitable for high speed printing up to 125 mms-1 Improved reflow process window (high soak temperatures and time) with superior coalescence and wetting Very shiny
Quick Overview 8 Channels Profiler with Bluetooth Function HC-8 Bluetooth 8 Channel Reflow Profiler is an extremely useful tool for tuning the soldering process of SMT boards. By examining the graphic output of the unit's software, operators can ad
New Equipment | Solder Materials
8 hours in controlled environment) Prints consistently at a wide range of speeds Wide reflow process window for profiling Excellent wetting on a variety of surface finishes Maintains tack over time Suitable for SnPb eutectic alloys as well
New Equipment | Solder Materials
As the world's leading developer of advanced solder paste materials, Henkel delivers decades of technology and expertise for optimized process performance. With ground breaking new formulations to provide an easy transition to lead-free as well as pr
