New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
The 907 micro Placer series allows you to place and rework BGA, mBGA, QFP, and Flip-Chip devices quickly and accurately. This unit is quick and accurate for placing devices with the added option of built in rework. You can place and reflow devices w
The Core Leaching Autoclave is a system for removal of ceramic cores from aerofoils by means of eroding them away via a chemical process. It is important to remember that the Leaching Autoclave contains hot pressurised caustic when operating and is f
The MSL baking process at OX3 Corporation, (�MSL� stands for Moisture Sensitivity Level), is in accordance with IPC and JEDEC Standard "J-STD-033A," the joint industry standard for semiconductor handling, packing, shipping and the use of moisture/ref
New Equipment | Rework & Repair Equipment
Mobile Device Rework System Revolutionary new heaters and power controls provide extremely high performance. Compact in design with SRT’s latest rework technologies, the Micra addresses the challenges of reworking technologies such as PoP, QFN
Industries most advanced closed loop rework station available. Using highly reliable precise and unique IR heating systems the IR500A and IR550A have set themselves apart from other rework stations by being able to simply remove and replace component
MSD (Moisture Sensitive Device) control is widely recognized as the most critical and difficult material tracking application. MSD has a direct impact on the near- and long-term reliability of the finished product. Cogiscan��s MSD Control offers t
Multi-layered clean-film full sticky layers form mats that effectively capture dirt and dust from foot-traffic and equipment wheels before they enter the controlled environment. Each of the numbered layers of the mat peels off easily to reveal a new
New Equipment | Rework & Repair Equipment
Visit PSI's main BGA Reballing Services page for more information. PSI has over 20 years experience reballing BGA devices of every size, pitch, and package style: micro-BGAs Alloy conversion from Sn/Pb to Pb-free, or Pb-free to Sn/Pb Reclaim a
New Equipment | Board Handling - Storage
Eureka XDC-2001 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs http://www.eurekadrytech.com/fast-super-dryer/xdc-2001 Anti-static Glass, Anti-static Paint on Body and Shelves, Anti-static Caster / Stands, 1 M ω Ground Wire Capacity: 1314 L
