New Equipment | Rework & Repair Equipment
Pin Grid Array Extractors are available in two sizes and provide a quick and safe way to extract Pin Grid Array components from their sockets. All component sizes can be accommodated, as the tool is available in two or four grip models. Adjusting the
New Equipment | Rework & Repair Equipment
Conformal Coating Removal for Micro Abrasive Blasting Micro Abrasive Blasting helps remove conformal coating with precision avoiding any damage to the target circuit boards. This is so useful in semiconductor, electronics and medical industries. It
IC670ALG230 Analog Input Current 8 Pt. Grouped IC670ALG240 Analog Input Current 16 Channel IC670ALG620 RTD 4 Channel Isolated 3 wire IC670ALG630 TC 8 Channel IC670ALG310 Analog Output Voltage, 8 Channel, +/-10V, 0 to 10V IC670ALG320 A
Made from 100% nitrile, a preferred alternative to the traditional natural rubber latex fingercot. The QRP proprietary formulation of 100% nitrile is completely free of latex and latex proteins. Inherently anti-static, the 9C fingercot is ideal for u
- Flexible uses for all different kinds of Components like SMD, BGA, CBGA, CCGA, CSP, QFN, MLF, PGA and All Epoxy undefiled BGA .. etc . - Recommended for reworking All Plastic parts, PTH, Sockets, Connectors and Metal Shields . - Complete reworking
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
New Equipment | Board Handling - Storage
Prevent your components from micro-cracking during reflow with proper Ultra-Low Humidity Storage. DXU models of maintain1%RH Wide range of cabinets including UL/C models Conforms to IPC/JEDEC J-STD 033B.1 Dehumidifies ICs to prevent micro-crack
Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and alumi
New Equipment | Cleaning Equipment
Precision Fine Pitch Aperture Cleaners Thousands of dollars less than fully-automatic cleaners Low solvent usage and running costs Fast cleaning time of 1-3 minutes Minimal waste disposal Portable unit can be used directly on the screen printe
New Equipment | Solder Materials
The Xytronic LF-8800A 5 Tool Lead Free SMT Workstation, with an internal vacuum pump is XYtronic-USA’s best solution for all your soldering/desoldering equipment needs, especially for lead free applications! We believe you will be more than satisfied
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