i-TECH ASYMTEK - Fluid Dispensing & Conformal Coating BTU - Reflow & Cure Oven Technology COGISCAN - Material/Component Tracking CYBEROPTICS - 3D Print Inspection, AOI Inspection ECMG - Printed Circuit Board Technologies
i-TECH ASYMTEK - Fluid Dispensing & Conformal Coating BTU - Reflow & Cure Oven Technology COGISCAN - Material/Component Tracking CYBEROPTICS - 3D Print Inspection, AOI Inspection ECMG - Printed Circuit Board Technologies
MLT provides laser services to remove unwanted squeeze-out from exposed metal pads, traces, and cavities. Squeeze-out can take the form of polyimide adhesives or prepreg resins. Whether a part of your standard manufacturing process or needed for re
BP 256 ball attach adhesives have been designed to enhance solder joint reliability and eliminate cleaning process for ball bumping process of CSP, BGA, Flip chip and PoP (package on package) and so on, particularly for lead free application. During
Laser cut stencils c/w Electro-Polished (mirrored finish) Multi Step Stencils Rework mini stencils Surface Mount Transport Plates Metal Squeegee Blades and Blade Assemblies Ball Grid Array (BGA) Re-Ball Fixtures Photo Plotting Electro - Polishing Fra
World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati
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Our TGP110 thermal conductive adhesives is a series of reactive thermal grease with very thin BLT that eliminates micro-bubbles at the rough interface when applied. In service time, it can be cured to form thermal gel or thermal pad but with the perf
New Equipment | Education/Training
Bob Willis has an extensive range of training videos available online. The complete video collection is available to view online for a fixed fee, based on a six month period. After purchase you are provided with links to each of the online videos for
SMT 256B series dip adhesives have been designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application. SMT 256B is a kind of polymer adhes
Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underf
