New Equipment | Cleaning Agents
KYZEN E5611 is a concentrated aqueous cleaning chemistry designed to remove non-reflowed solder paste and uncured chip bonder adhesives from stencils and hardware following the printing process. E5611 works on a wide range of solder paste technologie
New Equipment | Cleaning Equipment
SMT PCB Cleaner UC-250M-CV PCB size 50﹡50~330﹡250 mm Adhesive roll 2 rolls Width adjustment Manual Weight About 120 kg Product description: SMT PCB Cleaner UC-250M-CV， PCB size 50﹡50~330﹡250 mm, Adhesive roll 2 rolls, Adhesive roll 2 rolls, We
New Equipment | Solder Paste Stencils
ALPHA® Stencil products are based on unique blends of advanced technology, the experience gained from having made over half a million solder paste stencils, the specialist knowledge that could only be accumulated by a company privileged to produce bo
New Equipment | Fume Extraction
Protect your Workers from Hazardous Fumes at a Competitive Price PACE’s Arm-Evac 150 captures hazardous fumes locally and is suitable for benchtop soldering and electronic rework applications including handheld machining operations and light, limite
New Equipment | Cleaning Equipment
SMT PCB Cleaner UC-250M Adhesive roll 2 rolls Width adjustment Manual PCB size 50﹡50~330﹡250 mm Weight About 100 kg Product description: SMT PCB Cleaner UC-250M, Adhesive roll 2 rolls, Width adjustment Manual, PCB size 50﹡50~330﹡250 mm, Weight
New Equipment | Cleaning Agents
CYBERSOLV® C8882 is a fast-acting stencil cleaning solvent designed for the understencil wipe process. CYBERSOLV® C8882 instantly dissolves all flux types within the solder paste, including water soluble, rosin and low residue no-clean fluxes. CYBERS
New Equipment | Assembly Services
PCB Assembly also called Printed Circuit Board Assembly. Established in 2007, Fuchuangke Technology is found as a reliable and leading PCB Assembly Company with consistent quality and excellent service. Our expertise business ranges from Prototype Ci
New Equipment | Cleaning Agents
AQUANOX A8820D is a pour and go engineered micro-cell cleaning fluid designed to remove wet solder paste and uncured adhesive from stencils used in surface mount printing processes. A8820D removes all un-reflowed solder paste using spray-in-air and s
New Equipment | Cleaning Agents
CYBERSOLV C8882 is a solvent-based stencil cleaning fluid specifically designed to clean solder paste, uncured SMT adhesive and flux residue from stencils, mis-printed PCBs, stencil tools and printing squeegees. C8882 can be used in automated underst
New Equipment | Cleaning Agents
KYZEN E5631 is designed to be used at low concentrations and ambient temperature in stencil cleaning processes including spray-in-air, understencil, and ultrasonic systems. E5631 was formulated with the worker and environment in mind and is a cost-ef
