New SMT Equipment: reworkable epoxy (Page 1 of 1)

SMT 158 Capillary Underfill

SMT 158 Capillary Underfill

New Equipment | Materials

Yincae’s SMT 158 Capillary Underfill is a combination of capillary flow and no-flow underfills, rapid curing, fast flowing and easy reworking liquid epoxy that can be used as an underfill for chip scale packages, ball grid array devices, PoP (package

YINCAE Advanced Materials, LLC.

DOT LINER 6.6 - Automated Dispenser

DOT LINER 6.6 - Automated Dispenser

New Equipment | Dispensing

Dispensing Equipment for Small Batches and Rework Micro dispensing for small batches and rework. Precisely dispense solder paste, epoxy and underfill with the highest consistency, even for the smallest dots. For 25 years MARTIN have been setting

MARTIN (a Finetech company)

Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

RE-7500

RE-7500

New Equipment | Printing

- Flexible uses for all different kinds of Components like SMD, BGA, CBGA, CCGA, CSP, QFN, MLF, PGA and All Epoxy undefiled BGA .. etc . - Recommended for reworking All Plastic parts, PTH, Sockets, Connectors and Metal Shields . - Complete reworking

Jovy Systems Limited

Stencils

Stencils

New Equipment |  

Laser cut stencils c/w Electro-Polished (mirrored finish) Multi Step Stencils Rework mini stencils Surface Mount Transport Plates Metal Squeegee Blades and Blade Assemblies Ball Grid Array (BGA) Re-Ball Fixtures Photo Plotting Electro - Polishing Fra

TW & MJ (2001) Co.,Ltd

Advanced Thermal Management

Advanced Thermal Management

New Equipment | Assembly Services

S-Bond® solders are unique in their ability to provide a high performance thermal joint between these materials. S-Bond materials offer approximately 10 times the thermal conductivity of most thermal epoxies along with the ability to bond in air with

S-Bond Technologies

Fluxometer® Flux Application Measuring Tool

Fluxometer® Flux Application Measuring Tool

New Equipment | Wave Soldering

Maximizes Yields and Reduces Rework The ECD Fluxometer® maximizes yields and reduces rework by qualifying your spray fluxer pattern uniformity and top-side-penetration. Improve Process Quality - Eliminate guesswork when it comes to managing the c

Electronic Controls Design Inc. (ECD)

Laser Cut Stencils

Laser Cut Stencils

New Equipment | Solder Paste Stencils

SolderMask Services - Stencils and Custom Stencils Since 1994, SolderMask, Inc. has fabricated solder paste stencil using a photo-chemical etching process. In 1998, we installed our first laser to cut the apertures of the solder paste stencil. Now,

SolderMask Inc.

Laser Cut SMT Stencils

Laser Cut SMT Stencils

New Equipment | Solder Paste Stencils

Tropical Stencil’s Laser Cut SMT Stencils are produced utilizing high speed lasers to produce the smoothest aperture wall possible. Far superior to chemically etched stencils, and with emerging new materials, stencils are produced using “fine grain”

Tropical Stencil

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reworkable epoxy searches for Companies, Equipment, Machines, Suppliers & Information

2024 Eptac IPC Certification Training Schedule

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
convection smt reflow ovens

World's Best Reflow Oven Customizable for Unique Applications
thru hole soldering and selective soldering needs

High Throughput Reflow Oven
SMT feeders

High Precision Fluid Dispensers
2024 Eptac IPC Certification Training Schedule

Best Reflow Oven
SMT Spare Parts

Private label coffee for your company - your logo & message on each bag!