RO3000® high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability. RO3000 serie
2929 bondply is an unreinforced hydrocarbon based thin film adhesive system intended for use in high performance, high reliability multi-layer constructions. A low dielectric constant (2.9) and loss tangent ( 2929 bondply is compatible with tradit
Layer Count: 2L Board Thickness: 0.8mm Dimension: 140*85mm Material: Rogers RO5880 Surface Copper: 35μm Min Hole Diameter: 2.0mm Min line Width/Space: N/A Surface Finish: ENIG Do you need a PCB for special signal requirement into your products? High
280°C). Unlike PTFE based microwave materials, no special through-hole treatments or handling procedures are required. RO4003C was designed with a dielectric constant of 3.38. The RO4350B has a dielectric constant of 3.48 and is UL94V-0 rated. RO445
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