New Equipment | Rework & Repair Equipment
Specification: Rated Power: 4000W Rated voltage:AC220V /AC110V optional The first upper zone power: 800W Second temperature lower power: 800W Lower part of the preheating temperature zone Power: 2400W Dimensions: L500mm * W420mm * H550mm Weigh
New Equipment | Rework & Repair Equipment
Feature: 1. Adopt high standard materials(PLC, temperature table, heater) to allow better control of soldering/de-soldering process. 2. 3 independent heating areas from top to bottom. 3. (K Sensor) closed loop, independent heating 4. Protect the
New Equipment | Rework & Repair Services
Complete BGA rework service. Remove - reball - replace - xray.
New Equipment | Assembly Services
US Based PCB Assembly Contract Manufacturer Since 1987, AGILITY mfg has specialized in the assembly of printed circuit boards and the manufacture of electro-mechanical assemblies for electronic design facilities, engineering firms, and OEM's. We
Stencils, metal mask tools used for the deposit of solder paste or preformed solder balls onto BGA substrate. Please call for the best process for your requirements.
New Equipment | Rework & Repair Services
Our expert team is equipped to deal with the most sophisticated PCB assemblies, deploying leading-edge technologies such as the Air Vac DRS-24C BGA Rework Station to overcome the most complex process challenges. To give you a better idea of how we c
We will rework your SMT / BGA component using hot air, heat platform, convection air flow etc
Transition to Lead free will impact almost everyone in the electronics industry whether you consider yourself RoHS exempt or not. This is not a theoretical course. The objective of this course is to show you how you can resolve the business and techn
LIGHTSPEEDMFG provides quick-turn BGA services including rework and reballing. It's our specialty! We're your best choice for rework, reballing, inspection, ECOs and upgrades, for BGA, CGA, �BGA, and other component types. Our advanced BGA rework
BGA component types, characteristics, eutectic and non-eutectic solder, ceramics, determination of profiles, equipment, BGA removal, site preparation, reballing, soldering , cleaning etc.
