Surface Mount Technology (with BGA's) Mixed Technology Through-Hole Technology Rigid, Rigid Flex, and Flex Circuit assembly Testing (functional, manual, troubleshooting), Flying Probe and ICT (outsourced) Conformal Coat Systems Integration and Box Bu
multi-layer printed circuit boards that meet RoHS, Ul, IPC standards.
New Equipment | Assembly Services
Wire and cable harnesses. Pick and Place services. Through hole services. Soldering services, Tin/Lead & RoHS. Box build. Testing services. KanBan services. Logistics/Drop ship services. Repair services.
Eleclink manufactures high performance products. We can provide a remarkable range of customized PCBA solutions to meet our customer's SPEC. design needs. We provide the procucts with Lead-Free and RoHS. Our standard PCBA products is as following:
Aerosol Pump Spray 1 gallon Pail 5 gallon Pail 55 gallon Drum Ultra-Pure Isopropyl Alcohol Mild and Safe Excellent Compatibility with Components and Plastics Leaves No Residues Trigger Grip� compatible
NanoFoil® reactive multi-layer foil is a controllable and affordable bonding material, proven to lower manufacturing costs while providing repeatable and reliable bonds. NanoFoil® is a reactive multi-layer foil that provides instantaneous heat for
Panasert, Dynapert, Universal, Sanyo, Fuji, TDK, KME, Yamaha, Quad, Camalot, Juki, MPM, Minami, DEK, Samsung, Tenryu, Nitto, Electrovert, Sensbey, Soltec, Koki, Tamura, Yokota, Iemme, etc
New Equipment | Assembly Services
SMT and Through-Hole PCB Assembly. Turnkey and Consigned Service. Worldwide sourcing of high quality components at low cost. RoHS compliant or Leaded soldering. Final assembly and Box build Prototype, pre-Production, NPI Service Design Assistance Rew
New Equipment | Rework & Repair Equipment
SemiPack offers BGA Reballing Services with speed, reliability and affordability that are unrivalled in the industry. The Restriction of Hazardous Substances (RoHS) directive restricts the use of lead in nearly all electronic components used today.
