New SMT Equipment: rohs compatible component (Page 6 of 72)

GF-DL-HT Hot Plates

GF-DL-HT Hot Plates

New Equipment | Reflow

Reflow hot plate used for a variety of heating applications which include preheat, rework, reflow and curing of printed circuit board assemblies. The GF-DL-HT is capable of lead and lead free, high temperature applications and has dual programmable,

DDM Novastar Inc

GF-12HT Benchtop Reflow Oven

GF-12HT Benchtop Reflow Oven

New Equipment | Reflow

Reflow oven utilizing our 100% patented forced air Horizontal Convection™ Heating technology provides for greater thermal uniformity and process control. The GF-12HT is lead -free compatible for RoHS compliant soldering. 100 menu profile storage

DDM Novastar Inc

RoHS Compliant Contract Manufacturing

RoHS Compliant Contract Manufacturing

New Equipment |  

Lead Free Processing. RoHS Compliant Turnkey Contract Manufacturing Services.

NAT

Selective Solder Fixtures

Selective Solder Fixtures

New Equipment | Board Handling - Pallets,Carriers,Fixtures

Selective solder fixtures protect bottom side SMT components & eliminate the risk of loosing parts in the solder. Our unique designs will eliminate skipping and bridging. No need to tape areas which reduces operator time and speeds up your line.

MB Manufacturing

J8 No Clean Jetting Solder Paste

J8 No Clean Jetting Solder Paste

New Equipment | Solder Materials

AIM’s J8 No Clean Jetting Solder Paste is specially formulated for use with jetting equipment providing consistent solder deposits as small as 200μm. J8 is fully compatible with all AIM no clean solder pastes for use in applications where combining j

AIM Solder

H10 Halogen-Free No Clean Solder Paste

H10 Halogen-Free No Clean Solder Paste

New Equipment | Solder Materials

90% on area ratios of 0.50 and a stencil life >8 hours. H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical r

AIM Solder

WL 66O Optical Lens Adhesive

WL 66O Optical Lens Adhesive

New Equipment | Materials

WL 66O is one part 100% solid, dual cure UV bonding adhesives, which has been designed for wafer-level lens or optical lens attachment. It can be cured by UV in a few seconds to achieve fast fixing purpose, then further cured by thermal cure to achie

YINCAE Advanced Materials, LLC.

Nikko-Rack PCB Magazine Rack

Nikko-Rack PCB Magazine Rack

New Equipment | Board Handling - Storage

The most sophisticated PCB magazine rack available in the market today! Quick-Width Adjustment Magazines. The Nikko-rack PCB magazine product line includes quick width adjustment magazine for frequent PCB width adjustement, as well standard screw

Nix of America

PCB Assembly

New Equipment | Assembly Services

Printed Circuit Board Assembly (1206 to micro BGAs) (Rohs - non Rohs) [All paste types ( water soluble, no clean etc)]

Cancino Technologies Corporation

NanoSlic™ Gold Stencils

NanoSlic™ Gold Stencils

New Equipment | Printing

NanoSlic™ Gold is our top of the line spray on coating applied to our UltraSlic™ solder paste stencil, which gives previously unseen performance benefits in transfer efficiency. The NanoSlic™ Gold coating also gives the benefits of improved under-ste

Fine Line Stencil, Inc.


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