Conductive Foil Tapes Our range of conductive foil tape offers a cost-effective solution to EMC shielding. Tapes are available in both copper and aluminium with a conductive adhesive. The tapes can be used to seal joints on enclosures and for ground
New Equipment | Cleaning Agents
KYZEN® E5321 is a room temperature pallet and maintenance cleaning agent. This cost effective chemistry removes all types of solder paste and flux residues, including baked on and hardened lead free high temperature flux residues from wave pallets an
IKEUCHI's AKIMist"E" Dry Fog Humidification System provides uniform stable humidity, and expect the following effects. 1. Prevents ESD damege, static issues(Ex. Picking Failure) 2. Stable screen printing performance by keeping solder paste in goo
New Equipment | Assembly Services
From prototype to production and quick-turns to standard and scheduled deliveries, let our highly competent in-house PCB assembly operation handle all of your assembly needs. Although we feature high-speed pick and place machines, multi-zone reflow
Complex functions are compressed on ever less room while simultaneously an enhancement in performance must be obtained. With coated Bonding pads in various designs Heraeus Materials Technology offers customer oriented solutions that aid the increas
Oleophobic and Hydrophobic Electronics Coatings Aculon's repellency treatments can be used to modify a broad range of materials used in electronic applications including metals, metal oxides, polymers, and ceramics. Hydrophobic and oleophobic repel
HT172 ESD anti-fatigue mat 1,Size: 600*450*17mm,710*610*17mm,900*600*17mm,900*800*17mm, 8m*0.9m*17mm, 900*1500*15mm,400*600*15mm,etc... 2,Component: 1)Component 2 layer:Surface layer PVC+middle layer high elasticity composite cotton 2)Comp
New Equipment | Cleaning Agents
JNJ Industries was the first company in the SMT PC Board Assembly industry to offer under stencil wiping rolls other than the stencil printer manufacturers. JNJ manufactures all of our SmartRoll® stencil rolls right in our Franklin, Massachusetts pro
For die attach and general electronics assembly Die Attach Adhesives Zymet's electrically conductive die attach adhesives for semiconductor package assembly, hybrid IC assembly, COB IC assembly, and smartcard IC assembly. The adhesives are syring
For encapsulation of wirebonded IC’s Zymet's glob top and dam-and-fill encapsulants are UV curable, yet they have properties similar to conventional heat cured encapsulants, high Tg’s and low CTE’s. With UV cure, curing is performed quickly, inline
