New SMT Equipment: rough solder joints (Page 1 of 10)

Desktop Reflow Oven R1825

Desktop Reflow Oven R1825

New Equipment | Reflow

This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the temperature control

HuiKe Tech

Lead Free Desktop Infrared  Reflow Oven 1816

Lead Free Desktop Infrared Reflow Oven 1816

New Equipment | Reflow

The R1816 infrared reflow oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the

HuiKe Tech

Desktop Reflow Oven R3028

Desktop Reflow Oven R3028

New Equipment | Reflow

Introduction This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the tempe

HuiKe Tech

SMT 256  Solder Joint Encapsulant

SMT 256 Solder Joint Encapsulant

New Equipment | Materials

World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati

YINCAE Advanced Materials, LLC.

S3016 - Bottom-Up AOI

S3016 - Bottom-Up AOI

New Equipment | Inspection

Solder joint inspection of bottom-side PCBs Intelligent Inspection of Solder Joints, THT and SMD Components Today, the industry standard quality assurance in electronics production is automatic optical inspection (AOI) of SMD components on printed

Viscom AG

Kapp 509 - Cadmium Zinc Multipurpose Solder

Kapp 509 - Cadmium Zinc Multipurpose Solder

New Equipment | Solder Materials

Cadmium-Zinc solders are medium temperature alloys that provide strong, corrosion- resistant joints on most metals. The eutectic solder is the industry standard, Kapp 509. It melts and solidifies at 509°F and 265°C, making it an ideal solder for oven

Kapp Alloy & Wire, Inc

Kapp Antimonial Tin - Lead Free Solder for Electrical or Electronic Connections

Kapp Antimonial Tin - Lead Free Solder for Electrical or Electronic Connections

New Equipment | Solder Materials

95% Tin / 5% Antimony a.k.a. "Antimonial Tin" is a Lead solder replacement for soldering electrical equipment, Copper tubing, and cooling coils for refrigerators. Joints are of moderate strength where the higher strength and higher cost of KappZapp™

Kapp Alloy & Wire, Inc

Low Melting Type BGA Solder Ball

New Equipment |  

Sn-Zn-Al, Sn-Zn-3Bi, Features; Luster/Strong Joint, Melting Temp. 199C, �80-760�m

CCT Europe BV

KappZapp7R Rosin-cored Solder

KappZapp7R Rosin-cored Solder

New Equipment | Solder Materials

KappZapp7R Rosin-cored Solder has rapidly become the audio industry standard for electrical / electronic Copper applications. The 7% Silver solder creates extremely clean conductive joints with high strength, ductility and corrosion resistance. The c

Solder Direct

OptiCon THT-Line

OptiCon THT-Line

New Equipment | Inspection

The OptiCon THT-Line AOI system provides a parallel inspection of THT components and THT solder joints. In a typical THT production line,  it is possible to inspect mounted components before the soldering processes as well as PCB solder joints during

GOEPEL Electronic

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