Advanced semiconductor packaging and high precision SMT assembly convergence. Galaxy unites advanced semiconductor packaging and high precision next-generation SMT assembly on the same platform. This level of convergence delivers the advanced techno
Automatic Identification for Wafer Traceability The intensely competitive global semiconductor industry demands ever more rigorous control of increasingly complex processes in order to maximize tool utilization and production yield; there is zero m
Overview The DMAC is hardware implementation of media access control protocol defined by the IEEE standard. DMAC in cooperation with external PHY device enables network functionality in design. It is capable of transmitting and receiving Ethernet f
New Equipment | Cable & Wire Harness Equipment
The flexible High Performance model CrimpCenter 67 holds up to 7 stations (max. 3 crimp stations) on one platform and is specialized for customers with a large variety of standard and special applications such as crimping, doubling, sealing, tinning
Where High Mix Meets High Speed. With the MY100e series pick-and-place machines, there’s no need to make the usual trade-offs between speed and flexibility. With the fastest changeovers in the industry and workcell solutions reaching speeds of up t
Virtual Panel Tooling provides just that: dozens of substrates are independently aligned, simultaneously, creating a virtual panel ready for imaging in a single cycle. This concept delivers high throughput comparable to processing panelised substrate
New Equipment | Assembly Services
Para Coat Technologies was established in 2009. PCT is a manufacturing service provider specializing in the application of Parylene conformal coating and also provides Acrylic, Silicone and Urethane conformal coating along with Parylene Equipment Sal
Convection reflow oven for PCBs with 5 zones on top and five bottom vertical heating zones, the NEW GF-125 HC/HT is an economic solution for automatic medium volume production runs. Utilizing horizontal convection heating technology, the GF-125 HC/H
New Equipment | Fabrication Services
8 Layers Printed Circuit Boards Manufacturing Multilayer PCB Fabrication Product Name: Multilayer PCB Board Material: FR4 Copper thickness 1 oz all layers Board Thickness: 1.6mm Special requirement Impendence Control Fab by Circuit Boar
The SDV-111 series led signs are versatile and instant to run. The main features include: - 16 colors with 7 English and European character fonts - large storage of 100 pages or 7,000 characters - 24 eye-catching display effects - built-in message d
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