New SMT Equipment: sac405 melting point (Page 1 of 3)

Succinic anhydride

Succinic anhydride

New Equipment | Materials

Succinic anhydride Cas : 108-30-5 Appearance: White flake Purity: 99%min        Heavy metal: 20ppm max Melting point: 118-120℃

Cangzhou Goldlion Chemicals Co.,Ltd

Formosa Low Temperature Solder Paste

Formosa Low Temperature Solder Paste

New Equipment | Solder Materials

Shenmao Technology has developed Low Temperature Solder Paste for SMT devices. The Low Temperature Solder Paste has been qualified by third party organization. Low Temperature Solder Paste: Sn42Bi58 Melting point: 138℃

Shenmao Technology Inc.

LEAD FREE REPAIR SYSTEM

LEAD FREE REPAIR SYSTEM

New Equipment |  

- Higher power optimizes temperature control. Suitable for high melting point requirement of lead- free solder�� - Soldering iron with built-in suction that effectively absorbs poisonous fumes produce during the process of soldering. It also purifies

AOYUE TONGYI ELECTRONIC EQUIPMENT FACTORY

Indium

Indium

New Equipment | Solder Materials

5N Plus produces indium in pure metal, chemical and low melting point alloy forms for use in electronics, solar cells and optics. Indium is essential in forming transparent electrodes from indium tin oxide (ITO) in liquid crystal displays (LCD) and t

5N Plus inc

Ronidazole

Ronidazole

New Equipment | Materials

Ronidazole Cas No: 7681-76-7 Formula Weight: 200.15 Storage temp.: -20 C Melting point: 168-169 C Appearance: milky white crystalline powder. Capacity: 8MT/Year If you are interested, please contact us freely. Emily Liu Cangzhou Goldli

Cangzhou Goldlion Chemicals Co.,Ltd

Lead Free Technology For Electronic Assemblies Problems and Promises

New Equipment |  

Transition to Lead free will impact almost everyone in the electronics industry whether you consider yourself RoHS exempt or not. This is not a theoretical course. The objective of this course is to show you how you can resolve the business and techn

Ray Prasad Consultancy Group

KappAloy9 - Tin Zinc Solder for Aluminum to Aluminum and Aluminum to Copper

KappAloy9 - Tin Zinc Solder for Aluminum to Aluminum and Aluminum to Copper

New Equipment | Solder Materials

KappAloy9™ - 91%Sn - 9%Zn - 390°F (199°C) eutectic alloy is the best solder for soldering Aluminum wire to Copper busses or soldering Copper wire to Aluminum busses or contacts. Its low eutectic melting point minimizes heating of critical electrical/

Kapp Alloy & Wire, Inc

KappRad - The Radiator Repair Solder

KappRad - The Radiator Repair Solder

New Equipment | Solder Materials

KappRad has been developed specifically to join and repair Aluminum and Aluminum Copper radiators and heat exchangers. A lower melting point makes delicate repair work easier. Matching KAPP Golden Flux acts as a temperature guide to ensure simple app

Kapp Alloy & Wire, Inc

Hydantoin

Hydantoin

New Equipment | Materials

Hydantoin Cas No: 461-72-3 Purity  ≥98.5% Melting point: 215℃ Sulphate :0.5% Heavy metals:0.0020% Iron (Fe)  :0.002% Loss on drying  :        0.5% Appearance         White crystal More details, please contact us freely. Thanks Emily Li

Cangzhou Goldlion Chemicals Co.,Ltd

“Hybrid” High Reliability Low Ag Solder Paste

New Equipment | Solder Materials

Tokyo, Japan – Koki Company Limited, global manufacturer and supplier of soldering materials, announces the release of new low Ag containing halogen free solder pastes that secures the equivalent joint reliability and heat profile to SAC305, namely S

Koki Company LTD

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