Layer: 2L Base Material:CEM-3 CTI300 Board Thickness: 1.6mm Final copper: 35um Surface Finish: Immersion Tin/Sn Solder mask: Green Silkscreen: white Profile: Routing + v-cut E-test: 100% Fixture Quality report: Solderability test, F
Specification: 8L(1+6+1) Material: FR-4 Board thickness: 1.0mm Final copper: 18um Solder mask color: Green Silkscreen: White Surface Finish: Immersion Gold Profile: Routing and stamp holes E-test: 100% Fixture Quality report: Solder
New Equipment | Solder Materials
Solder Testing from $79 to $149 If you have a wave solder machine, a solder dip pot, or selective soldering system then you should consider the consequences of not monitoring your solder pot. An informal 20 year survey of the electronics manufactur
Layer: 10L Base Material:FR-4 tg180(ITEQ) Board Thickness: 1.6mm Final copper: 35um Surface Finish:Immersion Gold/Au:2u” min. Gold fingers/Au:30u” Solder mask: Green Profile: Routing E-test: 100% Fixture Quality report: Solderability test, Fi
Specification: 6L Material: FR-4 TG170 Board thickness: 1.6mm Final copper: 35um Solder mask color: Blue Surface Finish: Immersion Gold, Au:3u” min. Impedance control Profile: Routing E-test: 100% Fixture Quality report: Solderability
Layer: 1L Base Material:CEM-1 CTI600 Board Thickness: 1.6mm Final copper: 35um Surface Finish: HAL lead free Solder mask: Matt Green Silkscreen: white Profile: Routing + v-cut E-test: 100% Fixture Quality report: Solderability test,
New Equipment | Test Equipment
Quickshot XRF already offered a Handheld XRF analyzer for detection of hazardous substances but realized a need for analysis of small electronic components...to meet this interest the desktop QSX-82D was developed. This efficiently designed system
Material: CEM-1 Layer: 1 Thickness: 0.8mm Surface treating: Pb free HAL Solder mask: Green Min. Line/Space: 0.2mm Min. Hole: 0.3mm Lead Time: Sample 3 days S. 5 m2, 10 days Profiling: Routing Copper: 1oz Electronical Test We are always
Left: This part looked ok to the naked eye. Right: A microscopic view shows evidence of this part being previously soldered or reworked. Another part caught and prevented from being a potential problem for our customer. Decapsulation, Pinpri
Akrometrix Studio is an advanced set of integrated software modules that work together to provide the most comprehensive set of surface characterization and analysis capabilities available. When used with the TherMoiré AXP surface measurement system,
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
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1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
