New Equipment | Board Handling - Conveyors
[Apply] This Multi Magazine Loader is designed for loading of PCBs. The unit loads your production line automatically by pushing PCB��s out of a magazine onto the conveyor of the down-stream machine. [Features] 1. PLC Control system. 2. FUJI
Product Name: MPM Stencil Paper Roll Part No:HT16-MPM core id: 19.5mm core length: 455mm, 457mm paper width: 250mm, 300mm, 350mm, 440mm, 443mm, 445mm, 450mm. paper length: 9m, 10m, 11m, 12m. Qty:1roll/pc Color: White The standard sepcifica
Advanced Solder Paste Printer with 2D SPI On-Board. Auto screen printers with Advanced Vision System for all PCB types. Standard Features Include: 2D Solder Paste Inspection 3 Stage Automatic Conveyor Under Stencil Cleaning Ful
New Equipment | Cable & Wire Harness Equipment
Overview Schleuniger's PullTester 27 is a dual-range, motorized benchtop device designed to measure pull forces of wire crimp connections as well as ultrasonic metal welding connections on a wider range of wire than single-range pull test devices.
New Equipment | Rework & Repair Equipment
The AT-GDP Series BGA Rework Systems are semi-automatic machines featuring the latest vision and process control technologies. Lead-Free applications consisting of complex components such as BGA’s, CSP’s, QFN’s, Flip Chips, and other SMD’s are rework
New Equipment | Solder Materials
With its tin-copper-nickel-germanium alloy, SN100C is a popular lead-free wave soldering alloy. Although initially developed to address the need for an economical wave solder, it has since been found that its properties make SN100C ideal for reflow a
New Equipment | Cleaning Equipment
Maximize your stencil cleaning results! AKS Stencil Cleaner provides microscopic, ultrasonic removal of solder paste and post-solder flux buildup. All-in-one cleaning All “workstations” included in one compact unit, minimizing required floorspace.
Advanced Dual Lane Solder Paste Printer with 2D SPI On-Board. Dual lane screen printers with Advanced Vision System for all PCB types. Standard Features Include: 2D Solder Paste 3 Stage Automatic Under Stencil Cleaning Full Proce
MODEL NAME:HP-350M ;HP-520S ; HP-680S ; HP-850S ; HP-1000S Benefit High speed printing realization (2.0Cpk @ ±25㎛) Fine Pitch(0.2mm) , CSP , 0402 Control of printing speed and pressure over 5 sections Various P
New Equipment | Rework & Repair Equipment
Standard Features: 600 W - Dedicated Solder Scavenger Heater Dynamic Height Sensing - real time control of scavenger gap Dual Gas Inlets - (CDA & N2 with Two Stage Pressure Regulator) Top Heater Gas Saver - (saves CDA or N2 during preheat) 18
