Offering HCT-530SV semi-automatic LED Chip Mounter / LED Pick and Place Machine. * Placement rate (optimized) 42,000CPH * 8 placement heads * Maximum PCB size 1500×400mm * Placement accuracy: ±0.05mm * Component range: 0603～5050～7474,
Offering HCT-330SV semi-automatic LED Chip Mounter / LED Pick and Place Machine. * Placement rate (optimized) 36,000CPH * 8 placement heads * Maximum PCB size 1500×390mm * Placement accuracy: ±0.05mm * Component range: 0603～5050～7474, h
Dual Lane Screen Printing. The SPD (screen printer dual) features high-speed simultaneous production of two boards of the same type or two completely different products. Non-stop model changeover capability allows changeover of one stencil while th
New Equipment | Solder Materials
WS159 water washable solder paste is designed to provide humidity tolerance and excellent wetting to meet the requirements for reliable solder joints in PCB Assemblies. WS159 offers high levels of repeatability and consistency even in a wide range of
New Equipment | Cleaning Equipment
Aqueous / Semi-Aqueous Inline PCB Cleaning Systems Durable Construction The HydroJet™ in-line system is constructed of high-density polypropylene for excellent chemical compatibility and long life. It has a non-corroding rigid metal chassis, unib
New Equipment | Cleaning Equipment
PCB Stencil & Misprint Cleaning Systems Austin American Technology's X-Series™ Vertical Format Batch Cleaning Systems provide maximum chemistry flexibility to meet a wide variety of applications. Aqueous, saponification, semi-aqueous, alcohols and
New Equipment | Cleaning Equipment
There is nothing else like it! Designed, patented, and manufactured in the USA, the NanoJet™ from Austin American Technology combines recent advancements made in conveyor driven cleaning systems into the world's smallest, fully capable, inline cleane
New Equipment | Rework & Repair Equipment
The AT-707 series BGA Rework Stations are semiautomatic machines featuring spilt vision optics and precise software process control. Systems are used to rework various devices such as BGA’s, CSP’s, QFN’s, QFP’s, and other complex SMD’s in both Lead-F
The SPI 2500 is the next generation of off-line solder paste inspection system and features cost effective solution with the best accuracy. The optimal solution for monitoring and analysis of solder paste printing process. Measures Height, V
New Equipment | Board Handling - Storage
Prevent your components from micro-cracking during reflow with proper Ultra-Low Humidity Storage. DXU models of maintain1%RH Wide range of cabinets including UL/C models Conforms to IPC/JEDEC J-STD 033B.1 Dehumidifies ICs to prevent micro-crack
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
