New Equipment | Board Handling - Pallets,Carriers,Fixtures
EMC offers high quality wave solder pallets with short lead times. EMC's design team is the most experienced in the industry and can handle your toughest application. EMC pallets protect bottom side SMT, hold down floating components, selectively sol
1. Aluminum backed 2. Single sided 3. Thermal conductivity: 2.0W/MK 4. White solder mask/ no text 5. 1 OZ copper finished 6. 1.0mm finished thickness 7. Immersion gold 8. Hexagonal shape, punch profile
New Equipment | Board Handling - Pallets,Carriers,Fixtures
* Provides support to PCB preventing substrate distortion * Prevents bottom side components from double-sided reflow * Eliminates operator intervention for screening, placement, and reflow * Transports odd-shaped PCB through conveyor * Accurately loc
When time to market is the driving force, fast alternatives to pilot production runs can be the key to success. LPKF UV laser systems provide the flexibility, reliability and high precision that customers demand. By reducing product changeover time
Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t
Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t
Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t
Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t
Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t
Standard: ASTM F67, ASTM F136 Grade: Gr4 Gr5 Gr23 Dimension: Diameter 3-6mm, Length Shape: Round Technique: Forged Surface: Acid Washing Or Polishing
