New Equipment | Solder Materials
8 hrs. @ 30–45% RH & 22–25°C ~6 hrs. @ 45–70% RH & 22–25°C Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using 99% isopropyl alcohol (IPA) works well. Storage and Handling Proce
New Equipment | Solder Materials
Kapp Lunar Flux™ is a white paste for the high temperature soldering of Aluminum and Zinc die cast alloy. It is a reaction-type flux with 70% active ingredients dispersed in alcohol. Kapp Lunar Flux™ has considerable shelf life stability, as the susp
Don't Sacrifice PCBs for Profiling Double Sided Thermally Conductive Tape Used for Attaching Thermocouples to PCBS. Non-destructive TC attachment Reliable TC readings No waiting for curing or soldering Fast, easy setup Sold in 1
For die attach and general electronics assembly Die Attach Adhesives Zymet's electrically conductive die attach adhesives for semiconductor package assembly, hybrid IC assembly, COB IC assembly, and smartcard IC assembly. The adhesives are syring
This ruggedized military commercial off the shelf (Mil-Cots) AC-DC filtered 3 phase "Y" 120/208Vac input power supply has three +28Vdc outputs available with a total output capacity of 4500W. This COTS solution is designed to meet portions of MIL-STD
Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underf
New Equipment | Industrial Automation
Contact Emma Email: sales7@cambia.cn (Skype) Tel/whatsapp/Wechat :+86 18030273592 skype id: live:sales7_1232 Big Discount and New In Stock! More details please contact us! Other Products 6ES7414-4HJ04-0AB0
Epoxy 4089 is a single part, epoxy adhesive used for bonding SMT components to a PWB prior to double sided reflow or wave solder assembly. Epoxy 4089 has been formulated for use in all types of high speed dispensing equipment including air pressure,
New Equipment | Cleaning Agents
Introducing DJAW-10, our efficient under stencil wipe solvent compatible with all AIM solder pastes. Ideal for manual or automated application, DJAW-10 reduces solder paste dry-out, enhances fine aperture release, and cuts wipe cycles by 50% compared
Conductive Adhesive Film CAF-TD200,CAF-TD300 Product Characteristics: 1.Low moisture absorption 2.High reliability and conductivity 3.Excellent heat resistance 4.Long shelf-life 5.Good peel strength 6.Good binding force with PI and SUS 7.M
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