New Equipment | Solder Materials
Bars / Solid Wires Proposal Pro Contra Wave and selective soldering SN100C® Favourable price
New Equipment | Solder Materials
NC257MD solder paste has been specifically developed for Mycronic Jet Printers. Its unique rheological properties were engineered and validated through extensive testing in collaboration with Mycronic to provide continuous and consistent deposits. NC
New Equipment | Solder Materials
AIM introduces M8 Solder Paste, a high reliability no clean paste for use with SAC305, REL22, REL61, and Sn/Pb alloys. M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly success
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New Equipment | Solder Materials
LOCTITE GC 10 is a halogen free, zero halogens added, no-clean, low voiding, Pb-free solder paste specially formulated to provide added long term stability over a wide range of temperature conditions. The enhanced paste stability created through its
New Equipment | Solder Materials
Proposal Pro Contra Vaporphase OT2 SCAN-Ge XF3+ Large melting range Anti-Tombstoning Dull solder joints
New Equipment | Solder Materials
16 hours), and abandon time (>8 hours) Improved paste transfer efficiency Printing: Suitable for high speed printing up to 125 mms-1 Improved reflow process window (high soak temperatures and time) with superior coalescence and wetting Very shiny
New Equipment | Solder Materials
Solder additive to aid in reducing the solder dross buildup in both static and wave soldering pots containing SN100c. AO1000 can reduce solder usage by as much as 50%. FCT Assembly has developed AO1000 Anti-Oxidant Solder Additive to aid in reducin
New Equipment | Solder Materials
AIM’s J8 No Clean Jetting Solder Paste is specially formulated for use with jetting equipment providing consistent solder deposits as small as 200μm. J8 is fully compatible with all AIM no clean solder pastes for use in applications where combining j
New Equipment | Solder Materials
New Precision BGA Spheres Optimize Sphere Performance Indium Corporation’s Solder Spheres for PBGA, CBGA, TBGA, µBGA¬ and Flip Chip applications are made by a proprietary manufacturing process that consistently results in high sphericity and accura
New Equipment | Solder Materials
BGA Solder Sphere is made from pure metals, to produce exact alloy compositions. We developed and produced under a strict research and quality control policy. Our Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip applications are made by the UM
