Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
SMT Stencil Printer/ PCB Printers/ Solder Paste Stencil Printer Semi-Auto Main product: Stencil Printer, Semi-Automatic Printing, PCB Printer, screen printing, SMT Stencil Printer, SMT screen printer, SMT printer, Solder Paste Printer, SMT solder p
http://www.flason-smt.com/product/Siemens-12mm-16mm-original-feeder-00141092.html Siemens 12mm 16mm original feeder 00141092 SMT Spare Parts Seimens feeder Siemens 12mm 16mm original feeder 00141092 Usage: Seimens pick and place machine Produ
New Equipment | Solder Materials
We stock Amtech and Chip Quik Tacky Fluxes and Solder Paste. Availalbe in 10cc Syringe, 75 Gram and 150 Gram Jars. Check out our on line store: https://precision-pcb-services-inc.myshopify.com/collections/all Or call: (888) 406-2830
New Equipment | Test Equipment
Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808
The DV-7000 Heli-Flow® pump is a third-generation encoded auger pump. The pump has a floating head for use with footed needles to make fast, repeatable dots of solder paste and silver epoxy. The dispense gap is mechanically controlled by the needle,
The world-class precision and quality Spectrum® II system for assembly of mobile electronics, semiconductors, MEMS, and PCBs High Speed, High Accuracy, Precision Dispensing System. Higher consistency leads to higher yield and maximum profitability
