New Equipment | Education/Training
Blackfox’s Lead Free Soldering series minimizes the risks of conversion, and gives you the confidence to introduce lead free products and services quickly, with highest quality. The lead free certification program offers the latest requirements for S
KSUN R05 JUKI Feeder Calibration It is essential for this equipment that enhanced productivity , installation and quality improvement As the high efficiency vision camera is asked in order to investigate precisely and repair the error of device pos
Affordable Manufacturing Execution System (MES), Shop Floor Automation and Integration Software CELLS WORKFLOW Product Tracking MES is an affordable full Manufacturing Process Control Software System providing Plant Intelligence for any industry.
New Equipment | Fabrication Services
HITECH CIRCUITS has been providing RF PCB manufacturing facilities for years. The qualified professionals at HITECH CIRCUITS have expertise in Rogers PCB materials based PCB manufacturing. Fortunately, HITECH CIRCUITS has experienced RF Microwave PCB
Introducing the ezCLIP universal stop clip for PCB magazine racks. The ezCLIP system was created to allow electronics manufacturers who manually load/unload PCB magazine racks a simple way to distinguish required spacing between boards and to prevent
Panasonic MSHG3/MSHG2 Feeder Calibration JIG SMT Feeder Calibration Panasonic MSHG3/MSHG2 Feeder Calibration JIG SMT Feeder Calibration Specification: Dimension:500 x 350 x 550 mm , L x W x H Type:Pneumatic / Manual Monitor : 12” LED display, with
JUKI RS-1R Pick and Place Machine Applicable Components: 0201~5050Board size:50×50-650×370mmFeeder inputs:max.112placement capacity:47,000 CPHProduct description: JUKI RS-1R Pick and Place Machine, Applicable Components: 0201~5050,Board size:50×50-6
New Equipment | Rework & Repair Equipment
Eyelets are made from copper and are tin electronplated unless specified. Chose the proper eyelet keeping the following in mind: LUF The length of the eyelet barrel under the flange should be 0.020-0.035”/0.630-0.890mm greater than the thickness of
New Equipment | Test Equipment
Design-For-Test or DFT takes into account several major and minor considerations at the design layout stage. In this limited webpage space, the key ones are described. However, the overall DFT success for 90 percent plus test coverage relies heavily
500⁰C) Compatible with multiple lamination cycles Standard PCB lamination cycles may be used Excellent for Laser Via formation Excellent CAF resistance Uses standard desmear and plating processes High Modulus: 1100 kpsi Lo
winsouce.jpg)