New SMT Equipment: showed (Page 1 of 21)

JUKI RS-1R Pick and Place Machine

JUKI RS-1R Pick and Place Machine

New Equipment | Pick & Place

JUKI RS-1R Pick and Place Machine Applicable Components: 0201~5050Board size:50×50-650×370mmFeeder inputs:max.112placement capacity:47,000 CPHProduct description: JUKI RS-1R Pick and Place Machine, Applicable Components: 0201~5050,Board size:50×50-6

Qersa Technology Co.,ltd

JUKI RX-8 SMT Assembly Line

JUKI RX-8 SMT Assembly Line

New Equipment | Assembly Services

JUKI RX-8 SMT Assembly Line JUKI RX-8 SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 100000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and place machine

Qersa Technology Co.,ltd

Siemens 12mm 16mm original feeder 00141092

Siemens 12mm 16mm original feeder 00141092

New Equipment | Components

http://www.flason-smt.com/product/Siemens-12mm-16mm-original-feeder-00141092.html Siemens 12mm 16mm original feeder 00141092 SMT Spare Parts Seimens feeder Siemens 12mm 16mm original feeder 00141092 Usage: Seimens pick and place machine Produ

Flason Electronic Co.,limited

PCB Squeegees

PCB Squeegees

New Equipment | Printing

These can be used to roll solder paste through the stencil aperatures for prototype printing. One set custom made for stencil size. At soldertools.net we supply numerous types of metal stencils including framed, frameless and prototype stencils. We

BEST Inc.

IPC-A-600H Standard

IPC-A-600H Standard

New Equipment | Education/Training

IPC A-600H Acceptability of Electronic Assemblies. The IPC-A-600, "Acceptability of Printed Boards " is the most widely used published specification on printed wiring boards. This specification has set the standard for rigid printed boards in terms o

BEST Inc.

Solder Paste Dipping Plate

Solder Paste Dipping Plate

New Equipment | Solder Paste Stencils

These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on t

BEST Inc.

APR Component Printing Metal Stencil

APR Component Printing Metal Stencil

New Equipment | Solder Paste Stencils

Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printin

BEST Inc.

Component Printing Metal Stencil

Component Printing Metal Stencil

New Equipment | Solder Paste Stencils

Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printin

BEST Inc.

SMT Prototype Stencils

SMT Prototype Stencils

New Equipment | Solder Paste Stencils

SMT Prototype Stencils are laser cut solder paste prototype stencils designed to work on their own for hand printing. These laser cut prototype stencils do not need to be permanently glued in a frame. These so-called framelessstencils are less expens

BEST Inc.

Flip-up PCB Rework Stencils

Flip-up PCB Rework Stencils

New Equipment | Solder Paste Stencils

Flip Up SMT Rework Stencils are laser cut solder paste stencils designed to replicate the intial manufacturing process albeit for a designated component or selected area. These laser cut mini stencils can either have flaps (to prevent neighboring are

BEST Inc.

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