PLASMATREAT: Openair Plasma Process, Eliminating all Organic and Silicon-Based Contaminants Effectively Removes Electrostatically Attached Dust Applicable to Flat Surfaces as well as Complex 3D Shapes Atmospheric Plasma Process Reduces O
Our conductive silicone gaskets are constructed from silicone containing metal powder fillers which combine to produce high levels of attenuation with excellent environmental shielding and a high level of conductivity. Many types of filler, from nick
New Equipment | Rework & Repair Equipment
Conformal Coating Removal for Micro Abrasive Blasting Micro Abrasive Blasting helps remove conformal coating with precision avoiding any damage to the target circuit boards. This is so useful in semiconductor, electronics and medical industries. It
New Equipment | Board Handling - Storage
Eureka TD-1001 Fast Super Dryer Low Humidity Dry Cabinet Specs: http://eurekadrytech.com/fast-super-dryer/td-1001 Capacity: 657 Liters Humidity Range: LESS THAN 20% Recovery Time: Recovers to ≤ 20% RH within 30 minutes after accessing door for 30 s
New Equipment | Board Handling - Storage
Eureka TUS-1001 Fast Super Dryer Dry Cabinet Specs: http://eurekadrytech.com/fast-super-dryer/tus-1001 Model: TUS-1001 Fast Super Dryer Capacity: 657 Liters Humidity Range: 10%-50% Recovery Time: Recovers to ≤ 20% RH within 2 hours after accessing
New Equipment | Board Handling - Storage
Manual Wand for Semiconductor Wafer Handling Handle a fragile semiconductor silicon wafer softly but firmly without excessive touch. The surfaces of a wafer are never scratched in contrast to conventional metal tweezres. Our unique design (Pat
New Equipment | Cleaning Equipment
WHAT IS THE PRECISION MATERIAL REMOVAL SYSTEM™ (PMRS)? The Precision Material Removal System (PMRS) is a multi-faceted system designed to be effectively used in three different applications: 1/ Conformal coating removal 2/ PCB Delamination
Our leading products are researched, developed and manufactured at Keteca USA, in Phoenix Arizona. Solution to bonding problem? Keteca Diamaflow is the Answer! The Sub-Micron Technology of today and the future requires continued improved methods to
The Polyonics polyimide tapes combine the unique electrical, thermal, chemical and mechanical properties found in polyimide with Polyonics proven coating, adhesive and manufacturing technologies. The tapes maintain these excellent properties over a w
New Equipment | Cleaning Agents
MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302
