Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ M
New Equipment | Design Services
Layer：4 Material：FR-4 4/4/4/4oz Thickness：2.0 Minimum hole：0.35mm Minimum Tracc/Spacing：12mil/15mil Application：power supply Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width/space:
Layer: 6 layers Material: FR-4 Board Thickness: 1.0mm Surface Finish:ENIG Copper Thickness: 1 oz all layers Blind via L1~L2 and L1~L3 Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width
Layer: 2 Material: FR-4 Board Thickness: 1.6mm Surface Finish: HAL Copper Thickness: 2/2 oz Green Solder Mask Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width/space: 3mil/3mil Min
600V *RO4350B *RO4003C Dielectric material & Stack up requirement FR-4(no copper): 0.05-3.2mm for option Prepreg type: 7628H(7630), 7628(43%), 7628(41%), 2116HR, 2116, 2113, 1080 and 1060 for option Copper
Bicheng provides impedance controlled PCB's for R&D, high-tech, IT research companies and organizations, large or small. Technical parameters *Controlled dielectric *Controlled impedance *Design coupons *Test coupons *Po
Bicheng provides RD, high-tech, IT research companies and organizations, large or small with high quality bare PCB's PCB Products & Services * FR-4, High TG170, High CTI 600V * MCPCB, 1W/mk- 3W/mk * High speed
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8 Layers Printed Circuit Boards Manufacturing Multilayer PCB Fabrication Product Name: Multilayer PCB Board Material: FR4 Copper thickness 1 oz all layers Board Thickness: 1.6mm Special requirement Impendence Control Fab by Circuit Boar
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