The DV-7000 Heli-Flow® pump is a third-generation encoded auger pump. The pump has a floating head for use with footed needles to make fast, repeatable dots of solder paste and silver epoxy. The dispense gap is mechanically controlled by the needle,
New Equipment | Cleaning Equipment
SD3000 Pneumatic Silk Screen Cleaner Features： ●Dedicated to cleaning printing ink, glue and other thick film paste etc. ●Equipped with high precision filtering system ●Clean + rinse process to ensure cleanliness ●Liquid and pump pressure gauge can
Silver Filled, Electrically Conductive Ink for Screen Printing AG-800 is a unique, electrically conductive silver filled ink designed for high-speed screen printing in flex circuit, membrane switch, and other additive circuit applications. AG-800 i
Quick Overview Precision SMT stencil printer for fine pitch with vertical stencil separation Application: MSP-250 series is suitable for mobile phone motherboard, computer motherboards, single and double side PCB, LED display circuit boards, LED
G 5003 - LR Ink Mixer and Defoamer (Air Bubble Remover) R&D for Best Mixing Solution: Ink for Printed Circuit Boards, AB paste and Ag (Silver) paste mixing and defoaming solution. Great use for: PCB Factory, Glass Panel Factory, Photoelectric Ind
EP-1100 is a one-part adhesive epoxy designed for screen or stencil printing for component attachment, termination and other applications in: hybrid circuits membrane keypads other electromechanical assemblies EP-1100 exhibits excelle
New Equipment | Solder Paste Stencils
DESEN Classic 1008 SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±25μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum
New Equipment | Solder Paste Stencils
DESEN Hito SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±18μm@,6σ Process Alignment Capability ≥2 Cpk@±8μm@,6σ Cycle Time 7s Maximum Print Area 400mm
New Equipment | Solder Paste Stencils
DESEN Navigator SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±20μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum Print Area 6
New Equipment | Solder Materials
Cobar XF3 Solder Paste Completes SN100C Solder Materials System; Superior Reflow, Printing Performance over SAC Alloys. XF3 is a lead-free solder paste, developed to accommodate extended reflow profiles without use of nitrogen. XF3 completes the
