Be adequated to EMI solution,in general,applicated by computer equipment such as : - notebook - cellular phone - consumer electronics - communication equipment Structure : material : Nickel Silver,SPTE,Stainless Steel. FIX type : - Through Hole
General purpose placement with tape, tray and stick inputs. 30,000 cph. 120-160 8mm reels. A wide range of component, quick changeover capabilities Ensures continuous productivity by placing components from (01005”) 0402* to L 55 mm × W 55 mm or
The ScanCOMPONENT Product helps in creating vision files for your placement machines. It is its own standalone product or a module within the ScanINSPECT VPI product. ScanCOMPONENT is a PC-based offline component programming system for the creatio
The F209 fine-pitch SMT equipment is compact (4' in length) and features the new Flying Vision & Nozzle Change system that dramatically reduces time loss do to excessive head movement. Flying Nozzle Change (High-Precision Mounting) allows zero de-ra
Extreme high-speed placement with flexibility to handle larger components. Two independent work cells (stages) allow simultaneous assembly of two boards. All X and Y axes are operated by linear motors. Each Y axis has two motors for enha
Caters effectively to a wide range of production processes - it is also the world's fastest in its class. Caters effectively to a wide range of production processes – it is also the world’s fastest in its class Note: components mounting speed (CP
Ridiculously high-speed placement with flexibility to handle larger components. A placement system with the ludicrous placement rate of 95000 cph, and flexibility to place components ranging from 0201(0603mm) chip to 100x26mm connector. Two in
SCALABLE, COST-EFFECTIVE SOLUTION FOR HIGH-MIX & NPI Combines the capability, flexibility, and reliability you expect from Panasonic’s award-winning NPM and PanaCIM® Manufacturing Execution System (MES) into a cost-effective, high-mix solution. T
PRO 1600-RS is specifically configured for reflow simulation and thermal stress testing applications. This includes Preconditioning of Nonhermetic Surface Mount Devices (SMD) per JESD22-A113F standard, Moisture Sensitivity Level (MSL) testing of semi
MFR. PART NUMBER DESCRIPTION ALLEN BRADLEY 1747-ACN15 CONTROLNET 1.5 AND BEYOND 171 I/O ADAPTER ALLEN BRADLEY 1747-ACNR15 CONTROLNET 1.5 AND BEYOND 171 I/O ADAPTER ALLEN BRADLEY 1747-AIC ISOLATED LINK COUPLER FOR PLC ALLEN BRADLEY 1747-ASB SLC 50
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